Jetting and Microdispensing Solder Paste

Jetting and Microdispensing Solder Paste

Specifically formulated for fine-pitch and ultra-fine dispensing/jetting for various applications.

Features & Benefits

Jetting and microdispensing solder pastes are specifically formulated for fine-pitch and ultra-fine dispensing/jetting for various applications. Indium Corporation’s jetting and microdispensing pastes provide reliable dispensing of consistent size deposits in automated dispensing or jetting equipment.
Jetting or microdispense solder pastes include no-clean and water-soluble solder pastes, and are used with SnAgCu and SnPb alloy systems. It is important that they ONLY be used with the matched printable solder pastes. These products are designed for reflow in air or nitrogen atmosphere of 100ppm oxygen or less.

Jetting Solder Paste

Jetting
Introduction:

Jetting eliminates the need for a change in Z-axis movement. This significantly increases the speed that you can place deposits onto any surface versus contact dispensing. Jetting also makes it easier to deposit solder paste onto surfaces of varying heights.

Features and Benefits:
  • Increased speed
  • Constant Z-axis
  • Easily dispense on varying heights
Common Equipment Companies:

Mycronic, Musashi, Vermes, Camalot, Asymtek, Shinwa Marco, etc.

Microdispensing Solder Paste

Microdispensing
Introduction:

Dispensing has a variety of different methods for depositing material. The most common of these are Time/Pressure, Auger, and Diaphragm pumps. Dispensing allows for dot dispense and the ability to dispense a variety of unique patterns as well.

Features and Benefits:
  • Very fine deposits
  • Unique dispense patterns
  • No satellites
Common Equipment Companies:

NSW Automation, Musashi Engineering, GPD, Essemtec, Mycronic, Camalot, etc.

PicoShot® NC-5M Jetting Paste

Picoshot® NC-5M Solder Paste

Indium Corporation’s PicoShot® NC-5M jetting solder paste is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Inherently chemically-compatible with Indium8.9HF Solder Paste, PicoShot® NC-5M is optimized for long-term jetting. PicoShot® NC-5M provides exceptional jetting performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Indium12.8HF Solder Paste

Indium12.8HF Solder Paste

Jetting/Microdispensing Paste

Indium Corporation’s Indium12.8HF jetting and microdispense solder paste is a no-clean, halogen-free material specifically formulated to be compatible with a wide range of microdispense and jetting systems.

Inherently chemically-compatible with Indium8.9HF Solder Paste, Indium12.8HF is optimized for long-term jetting and dispensing. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Key Features of Indium12.8HF
Key Features:
  • Exceptional jetting: >200 µm
  • Exceptional microdispense: >80 µm
    • Precision deposit (x, y) targeting
    • Long usage (syringe) life
    • No bridging
Technical Information:
  • Alloy
    • Variety of different alloys can be used
  • Metal loading (ML)
    • 78-85% by weight
  • Powder size
    • IPC J-STD-005A: Type 5, 5MC, 6, 6SG, 6SGS, 7, 7SG
  • Indium12.8HF can be used with Pb and Pb-Free alloys; ML can be varied depending on application and jetting/dispensing system
PicoShot® Conditioner C-1

Picoshot® Conditioner C1

Indium Corporation’s PicoShot® Conditioner C-1 is a chemically benign bright blue-colored viscous gel material designed to allow the rapid purging and cleaning of jetting, dispense, and microdispense systems without the use of liquid solvents. It has been formulated to be non-corrosive and non-reactive with these systems.