GalliTHERM® Family

As a global leader in metal-based thermal interface materials, Indium Corporation brings decades of expertise as a trusted supplier of gallium-based materials. With high quality and lot-to-lot consistency built into every step of our controlled production process, we ensure reliable performance—especially due to Gallium-based alloys requiring careful handling as Class 8 (corrosive) materials. Leveraging our extensive expertise, we ensure safe and compliant packaging and transportation—by air, highway, rail, or sea—meeting all regulatory standards and delivering securely to your facility.

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  • High Thermal Conductivity
  • Low Interfacial Resistance
  • Exceptional Wettability
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Types of GalliTHERM®

We have three types of gallium-based materials:

or alloys that are liquid at room temperature

which are solid at room temperature

for use with high-viscosity gallium-based materials

Graph of thermal conductivity vs. temperature for various materials, featuring data points and Gallitherm trend lines from 0°C to 120°C.

Liquid Metals

These are pure metals or metal alloys that remain liquid at room temperature, with melting points ranging from 7.6°C to 17°C. The primary element in these alloys is gallium, which is often combined with other elements such as indium (In), tin (Sn), or zinc (Zn). All liquid metals from Indium Corporation are RoHS-compliant, non-toxic, and safely transported worldwide, adhering to global shipping requirements.

Phase Change Metal Alloys

Cross-sectional diagram of a Gallium Nitride chip assembly with labeled components: substrate, Gallitherm solder/DBC, and bonding layers.

Gallium Preforms

Gallium is a soft, silvery-white metal notable for its low melting point of about 29.76°C. For that reason, producing gallium as a preform is highly challenging. Indium Corporation has a proprietary process of producing pure gallium and gallium alloy preforms in variety of shapes and sizes with thicknesses down to 50 μm.

Liquid Metal (LM) Preforms

Indalloy®300E (Ga78.6/In21.4) is a eutectic gallium-indium liquid metal alloy known for its high thermal conductivity—the highest of any liquid metal. Adding more indium increases thermal conductivity, but the alloy remains liquid or pasty until the ratio reaches In97/Ga3, at which point it solidifies near indium’s melting point (156.6°C). To assemble, start by placing indium preforms on the heat source, ensuring the entire surface is covered. Next, place gallium preforms on top, ensuring they do not need to cover the entire indium surface.

A metallic silver substance, possibly Gallitherm, is delicately held by a tool over a blurred background, capturing the essence of innovative craftsmanship.

Liquid Metal Pastes

Liquid Metal Paste (LMP) is a next-generation, liquid metal-based thermal paste engineered for advanced thermal management in HPC semiconductor applications, including CPUs, GPUs, and MCMs. It is similar to standard gallium-based liquid metals. Through a proprietary process and certain additives, the viscosity is modified to form a homogeneous dispensable/jettable thermal paste for use in high-volume applications.

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Melting Point of 29.76°C

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Non-Toxic Alloys

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Extremely Aggressive

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Diverse Applications

Indalloy® NumberCompositionWhen to ChooseRecommended Operating Temperature (°C)Liquidus (°C)Solidus (°C)Thermal Conductivity (W/mK)Electrical Resistivity (µΩ-cm)Specific Gravity (g/cm³)
51EGa66.5/In20.5/Sn13Lower melting point eutectic alloy, best used in dispensing and printing applications-50-200°C11113728.9 (1) 6.32
300EGa78.6/In21.4Highest thermal conductivity and best for jetting applications-50-200°C15.715.74427*6.16
306 (AKA)Ga68.5/In21.5/Sn10Widely used in high-end gaming platforms-50-200°C191035*29*6.31*
60Ga75.5/In24.5Non-eutectic gallium indium alloy-50-200°C2315.720*26.86.35

Related Applications

GalliTHERM® products are suitable for a wide range of applications.

Illustration of a microchip with a transparent overlay, revealing internal components and electronic connections, highlighting the precision akin to a tim1 40 design.

TIM1, TIM1.5, TIM2

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Close-up of a microchip with a thermal pad layered on top, placed on a circuit board.

Immersion Cooling

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Related Markets

Indium Corporation’s GalliTHERM® products are applicable in a variety of markets.

Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!

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