产品 热界面材料 GalliTHERM® 系列

GalliTHERM®系列

As a global leader in metal-based thermal interface materials, Indium Corporation brings decades of expertise as a trusted supplier of gallium-based materials. With high quality and lot-to-lot consistency built into every step of our controlled production process, we ensure reliable performance—especially due to Gallium-based alloys requiring careful handling as Class 8 (corrosive) materials. Leveraging our extensive expertise, we ensure safe and compliant packaging and transportation—by air, highway, rail, or sea—meeting all regulatory standards and delivering securely to your facility.

技术支持:铟泰公司

  • High Thermal Conductivity
  • 低界面电阻
  • 出色的润湿性
GalliTHERM 徽标

GalliTHERM®的类型

We have three types of gallium-based materials:

或在室温下呈液态的合金

在室温下为固体

for use with high-viscosity gallium-based materials

液体金属

These are pure metals or metal alloys that remain liquid at room temperature, with melting points ranging from 7.6°C to 17°C. The primary element in these alloys is gallium, which is often combined with other elements such as indium (In), tin (Sn), or zinc (Zn). All liquid metals from Indium Corporation are RoHS-compliant, non-toxic, and safely transported worldwide, adhering to global shipping requirements.

相变金属合金

Gallium Preforms

Gallium is a soft, silvery-white metal notable for its low melting point of about 29.76°C. For that reason, producing gallium as a preform is highly challenging. Indium Corporation has a proprietary process of producing pure gallium and gallium alloy preforms in variety of shapes and sizes with thicknesses down to 50 μm.

Liquid Metal (LM) Preforms

Indalloy®300E (Ga78.6/In21.4) is a eutectic gallium-indium liquid metal alloy known for its high thermal conductivity—the highest of any liquid metal. Adding more indium increases thermal conductivity, but the alloy remains liquid or pasty until the ratio reaches In97/Ga3, at which point it solidifies near indium’s melting point (156.6°C). To assemble, start by placing indium preforms on the heat source, ensuring the entire surface is covered. Next, place gallium preforms on top, ensuring they do not need to cover the entire indium surface.

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Liquid Metal Pastes

Liquid Metal Paste (LMP) is a next-generation, liquid metal-based thermal paste engineered for advanced thermal management in HPC semiconductor applications, including CPUs, GPUs, and MCMs. It is similar to standard gallium-based liquid metals. Through a proprietary process and certain additives, the viscosity is modified to form a homogeneous dispensable/jettable thermal paste for use in high-volume applications.

Melting Point of 29.76°C

无毒合金

极具攻击性

Diverse Applications

Indalloy®编号组成何时选择Recommended Operating Temperature (°C)Liquidus (°C)Solidus (°C)Thermal Conductivity (W/mK)电阻率 (µΩ-cm)Specific Gravity (g/cm³)
51EGa66.5/In20.5/Sn13Lower melting point eutectic alloy, best used in dispensing and printing applications-50-200°C11113728.9 (1) 6.32
300EGa78.6/In21.4Highest thermal conductivity and best for jetting applications-50-200°C15.715.74427*6.16
306 (AKA)Ga68.5/In21.5/Sn10广泛应用于高端游戏平台-50-200°C191035*29*6.31*
60Ga75.5/In24.5Non-eutectic gallium indium alloy-50-200°C2315.720*26.86.35

相关应用

GalliTHERM® products are suitable for a wide range of applications.

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计时器 1、计时器 1.5、计时器 2

金属基热界面材料(TIM)具有出色的导热性能,并且……

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浸入式冷却

一种正在兴起的热处理技术……

相关市场

Indium Corporation’s GalliTHERM® products are applicable in a variety of markets.

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