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Thermal managementis becoming an ever more critical challenge for semiconductor devices, as the functional density and power density increase – especially with advanced packaging. Thermal test

As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

SMTA PanPac is a unique experience. In addition to the obvious draw of Hawaii in January, the conference tends to host thought leaders in the electronics industry. Along with the expected technical

Artificial intelligence and machine learning (AI/ML) can havevarious applicationsin smart manufacturing for semiconductor fab, advanced packaging, and electronics manufacturing, and it typically

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

Folks, Let’s look in on Ivy University Professor Patty Coleman as she chats with John Archer about Walter Isaacson’s biography of Elon Musk. “I have to admit, reading about

Typical analyses of low- and mid-temperature solders focuses on improvements to important metrics such as shock resistance and component resilience. What is less known–and even less

Electrification is changing the products and materials that are valued today. Investment in renewable energy is now 1.7x that of fossil fuels, and the utilization of Environment, Social and

Folks, It has been a very long time since we checked in on Patty. Let's see how she is doing… Patty was glad the Hal Lindsay episode was over. It should not have bothered her that he called

Folks, Continuing our post on thinking metric: I am 5 feet 10 inches tall, or 70 inches. There are 2.54 centimeters per inch, so 2 times 70 = 140, then 0.5 * 70 = 35, so 140 + 35 = 175 cm is close,

Folks, I was reading BBC’s Science Focus Magazine when I came across a reader’s letter to the editor in the October issue on page 12: “Reading the Q&A about fusion power

An Interview with Professor Patty Coleman. Dr. Ron: Professor Coleman, it has been quite a long time since we last chatted. Professor Patty: I agree, too long! And please, Dr. Ron,call me Patty. DR:

Folks, Good friends Phil Zarrow and Jim Hall did an episode on their world famous podcast,“Boardtalk,” on the importance of response to pause for solder paste during the stencil printing

Folks, This year SMTAI is in Minneapolis from October 9 to October 12. I will be giving a paper on hotbar soldering in the morning on Thursday October 12, as part of the technical

Folks, Digikey colleague Aaron Rollens developed the equation to convert the mass on a spool of solder wire into its length. I also developed the equation to convert a length of solder wire into its

This summer has truly flown by! It is hard to believe that there is only a week until Commencement. In this post, I'll take you through a snapshot of my journey, highlighting some of the

Folks, Let’s assume you would like to estimate the upper confidence limit of a failure rate. As an example, assume you have 21 samples of 1000 that

Folks, You are the project manager for a PCB that must function in an environment from -10 to 80 C. The PCB will experience one thermal cycle per day in this range in its application. It must

As the internship program has reached the halfway point, I am now able to reflect on all I have learned this

Folks, In my last post, I discussed the concern for copper-tin intermetallic (IMC) growth in solder joints at high service temperatures. Since then, I have developed an Excel® spreadsheet that