Skip to content

Reducing Voiding with LV1000 Flux-Coated Solder Preforms

Indium Corporation's Tim Jensen discusses voiding under QFN components, and how it is a significant challenge in the industry, especially for the thermal pad.

Keywords: Voiding, Tim Jensen, QFN Components, Thermal Pad, QFN, Indium Corporation, Indium, LV1000, Flux Coated Preform, Preforms, Tape and reel, Avoid the Void, [email protected]