CLINTON, N.Y., May 1, 2026 — As a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Company products to be highlighted include the following:
- Formic Acid Soldering Technology (FAST) is an ideal reflow method for power device packaging. Product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering that is ideal for efficient manufacturing of next-generation power electronics.
- Heat-Spring® is a compressible, non-reflow metal thermal interface material (TIM) ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability in low-temperature step soldering. It is ideal for assemblies with broad temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 with optimal process setup.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. These materials offer optimum transfer efficiency with consistent printing stability after continuous use and a long stencil life.
- NC-809 is a no-clean, ultra-low residue, ball-attach flux. Its dual-purpose engineering provides high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
To learn more about Indium Corporation’s high-performance materials solutions, visit indium.com or meet with our experts at SEMICON SEA 2006, booth #2269.
Acerca de Indium Corporation
IndiumCorporation® es una empresa líder en el refinado, fundición, fabricación y suministro de materiales para los mercados mundiales de electrónica, semiconductores, películas finas y gestión térmica. Entre sus productos se incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; blancos de pulverización; indio, galio, germanio y estaño metálicos y compuestos inorgánicos; yNanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica global y fábricas ubicadas en China, Alemania, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para obtener más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
