Applied Power Electronics Conference (APEC) – the leading conference in North America for power electronic professionals – returns to a fully in-person format this year after a year off and a virtual platform the past two years due to the pandemic. Indium Corporation is sending eight attendees to this year’s event in Houston (March 20-24) at the George R. Brown Convention Center. Our booth (1234) is located adjacent to ON Semiconductor and the APEC HUB.
[Hurry! If you haven’t registered for APEC 2022, use our registration code discount at the end of the blog for $50 off your full conference registration when you register before March 9.]
We discussed with our colleague Joe Hertline, product manager of ESM/Power Electronics, our presence at this year’s show and what we are most looking forward to.
Within the power electronics sphere, there are three key trends that global manufacturers are positioning themselves in front of: greater performance, increased component density, and higher reliability. For an inside look at how Indium Corporation is addressing these challenges, you can watch a recording of Joe’s InSIDER Series webinar: The Challenges of High-Reliability Power Electronics Assembly and the Emerging Materials Solutions. (The InSIDER Series is Indium Corporation’s free webinar program designed to provide engaging technical content.)
For the EV landscape, emerging performance and reliability requirements include smaller packaging footprints, extended battery life, rapid charging, great quality (defects of only ppb vs. ppm), and immediate scalability.
To meet some of these challenges, one product in Indium Corporation’s portfolio of high-reliability solutions for power electronics is Durafuse™ HT. Dr. HongWen Zhang will present DurafuseTM HT—A Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, at 8:55 a.m. Wednesday, March 23 in room 320C. Dr. Zhang will discuss how this new formulation of our innovative mixed-alloy technology Durafuse™ is delivering improved performance in power discrete applications.
Back at the booth, Indium Corporation’s team of experts will be available to discuss other options in the company’s arsenal of products, including InFORMS® – which were first introduced at APEC 2018, Heat-Spring® TIMs, and a new-to-market product InTACK™ – a near-zero residue adhesive solution specially formulated to hold a die, chip, or solder preform in place without movement, which ultimately results in a lower cost of manufacturing ownership.
As a global materials manufacturer and supplier to the power electronics and thermal management markets, Indium Corporation scientists, applications engineers, and technical support engineers work closely with our customers to develop custom solutions to their technical problems. During this year’s event, Joe and the Indium Corporation team at APEC encourage our current and future customers to engage with us in dialogue: bring us your thermal-side issues so we can better address them in future product releases.
Whether it is the evolution of the power package from the traditional IGBT to the more efficient dual-sided cooling modules, how to increase component density needs to balance with the requirement for reduced size/weight, or something in-between, our team is eager to engage with you.
We look forward to discussing your power electronics challenges, and how our bevy of products and global team of experts can best address them. See you in Houston, March 20-24.
Haven’t registered for APEC 2022? Follow these instructions to use Indium Corporation’s discount code to receive $50 off your full conference registration when you register before March 9.
- Visit the APEC registration website (http://apec-conf.org/conference/registration/)
- Select a registration type depending on your IEEE or PSMA member status
- Continue through the remaining registration pages
- Enter our Indium Corporation customer referral code: APEC2022EXHD50
When complete, a confirmation email will be sent. If you have any questions regarding registration, please contact APEC at firstname.lastname@example.org.
Authored by MarCom Specialist Christian Vischi with contributions from ESM/Power Electronics Product Manager Joe Hertline.