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First Pass Yield Continued

Folks, Let’s see how Patty is doing with her latest challenge….. Patty had decided to call The Professor and see what advice he had to offer in preparation for her visit to the facility

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Great First Pass Yield and Productivity, but Poor Profit?

Folks, Let's see what is up with Patty…….. Patty sat at her computer, admittedly a little tired. She had just gotten back after a week’s vacation in Colonial Williamsburg with

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Reflow of Copper Pillar Microbumps

Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding,

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Leadframe Solderability Issues in Power Semiconductors

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally

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Annealing NanoFoil®

NanoFoil®requires a threshold of energy to activate. What happens if that energy value is not met?: Interdiffusion and inhibition of the NanoBond® reaction. This can happen if NanoFoil®

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Soldering to Wood

Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden

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What Is Indium?

Being the Indium Corporation, we know what indium is, where it comes from, and how to use it. But sometimes we forget that not everyone is as immersed in indium as we are. So what is indium? Of

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Wet Gold: A Technique to Measure Density Without Knowing the Volume

Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy

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DIY: Applying Solder to Molybdenum, Titanium, and Tungsten (Ultrasonic Soldering)

There are many sputtering target materials that are tricky to solder to. For those alloys we ‘bring out the big guns’ – in this case, our ultrasonic soldering

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DIY: Applying Solder to Copper, Nickel, and Platinum (Flux)

In order to NanoBond® parts that are made out of copper, nickel, or platinum, we must first apply solder to the bonding surface. This is most commonly done by melting solder directly onto the

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Weibull Analysis III: Multiple Failure Modes

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

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DIY: Connecting NanoFoil®

Sometimes one piece of NanoFoil® just isn’t enough… We often NanoBond® sputtering targets which are large enough to require multiple sheets of NanoFoil® to cover the width or

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DIY: Hand Cutting NanoFoil®

Hand cutting is only one option for shaping NanoFoil®, however it is quick, easy, and inexpensive. All you need to cut NanoFoil® with this method is a good cutting surface, metal straight

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Weibull Analysis II: The Curse of the Early First Failure

Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated

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DIY: Electroplating NanoFoil®

A few years back, Indium Corporation's own Eric Bastow set up a prototype NanoFoil® plating process to demonstrate the material and cost savings of setting up a small plating bath. One of the

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Time Required for Refrigerated Flux and Solder Paste to Reach Room Temperature

One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use

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Addressing a Defect of Poor wetting and Non-Spread of Solder Preforms

We’ve heard about the solder paste “graping” defect, but the same oxidation challenge occurs in other solder forms as well, such as solder washer preforms used to attach small

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Sn-plated NanoFoil®

Tin-coated NanoFoil® is not one, but two very different products, combined. It is a heat source and a form of solder. In the world of interconnection, this is quite unique. (Shown in the picture

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Special Cause and Common Cause Variation and Knob Twiddling: continued

Folks, Let’s see how Pete is handling the wave solder crisis. Pete had to admit that he was surprised by the positive outcome of his meeting with Fred Castle. He had sent Patty a text the day

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Activation of NanoFoil®

NanoFoil® is described as “reactive multilayer foil”. It is comprised of many alternating layers of aluminum and nickel which are each only nanometers thick. These layers are waiting in close

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Special Cause and Common Cause Variation and Knob Twiddling

Folks, It's been a while. Let's look in on Patty…… Patty stared, bleary eyed, at her laptop screen. It was the day after the election. She and Rob were following the election

At Indium we research, develop, and manufacture advanced electronics assembly materials solutions to the challenges of today, tomorrow, and the future.