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解決焊料預型件濕潤不良和不擴散的缺陷

我們聽過焊錫膏的「グラグ」缺陷,但同樣的氧化挑戰也發生在其他焊錫形式中,例如用於固定小型焊錫的焊錫墊圈預型件。

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Sn-plated NanoFoil®

Tin-coated NanoFoil® is not one, but two very different products, combined. It is a heat source and a form of solder. In the world of interconnection, this is quite unique. (Shown in the picture

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特殊原因和共同原因變異與旋鈕擺動:續

各位,讓我們看看 Pete 是如何處理波峰焊危機的。Pete 不得不承認,他對於與 Fred Castle 會面的積極結果感到驚訝。那天他給 Patty 發了一條短信

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活化 NanoFoil®

NanoFoil® is described as “reactive multilayer foil”. It is comprised of many alternating layers of aluminum and nickel which are each only nanometers thick. These layers are waiting in close

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Special Cause and Common Cause Variation and Knob Twiddling

Folks, It's been a while. Let's look in on Patty…… Patty stared, bleary eyed, at her laptop screen. It was the day after the election. She and Rob were following the election

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如何將導線焊接到焊盤上

這件事看起來相當簡單。將導線焊接到焊盤上有什麼困難的?我聽到三個常見的抱怨和沮喪的表達:定位:通常,在焊接過程中,電路板上的焊線會被放置在焊盤上。

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NanoFoil® 的光學活化

Lasers and fiber optic waveguides can be used to activate NanoFoil®. Why would you want to use a laser to do this? It lends itself to automation: Imagine a part moving into position, the laser

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您的死亡率能否用韋布爾分佈來建模?

Folks, In the last posting, we saw how Weibull analysis helped us to determine that SACm® lead-free solder (SAC105 with about 0.1% manganese) has comparable (actually better) thermal cycle

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Weibull Analysis of Solder Joint Failure Data II

Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let's now derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the

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銦密封件

Due to its softness and compressibility, indium is ideal for use in creating a seal. Let's get right into it: Indium preforms are commonly used to create seals. The preforms are made into an

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含鉛與無鉛焊點的電子元件失效分析

Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. It is the first thought of someone trying to model thermal

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Statistically Significant vs Practically Significant Results in SMT Assembly

Folks, Everyday, we are exposed to the results of surveys and polls. A typical example might be that President Obama is leading Mitt Romney in a poll by 48% to 45%, but the results are not

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一探焊錫助焊劑筆的內部構造

Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN'T want to see THAT, right?!? Flux pens are commonly used to accurately supply small

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生產力永遠有價值

Folks, Let’s see how Patty and Pete are making out on their latest adventure…. “Here is the ProfitPro™ output,” Dave Ferris said as he pointed to a PowerPoint slide on the

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計算焊膏用量

Calculating the exact amount of solder paste needed for a given circuit board or for a full production run can be difficult for several reasons, including: print deposit variations paste left on the

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A Penny per Gram

Folks, It has been a while, let’s look in on Patty…… Patty had to admit that she was very fortunate. She had yet to turn 30 and she was a Senior Vice President at ACME. There was

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Cleaning No-Clean Solder Paste Residues in SMT Assembly

Folks, There is a lot of interest in cleaning PCBs that have been assembled with no-clean solder pastes. Recently I discussed the topic with my good friend Mike Bixenman of Kyzen. Dr. Ron (DR) Mike,

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水洗型焊錫膏助焊劑的 SIR 及 ECM 測試

It is not often that we get a request for SIR (Surface Insulation Resistance) and/or ECM (Electro-Chemical Migration) results for a water washable/soluble flux or solder paste, but often enough to

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旋轉濺鍍靶相對於平面濺鍍靶的優勢

I have been asked to explain why someone would want to use rotary sputtering targets instead of planar sputtering

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錫胡、焊料合金密度、安全:分享一些意見

Folks, Some time ago I wrote a post, “In Search of Tin Whiskers,” Michael responds below. He makes some good points. Dr. Ron, I'm responding to your blog regarding tin

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How Low is Low Temperature in Soldering?

Do you ever have a need for a "low temperature" solder (meaning an alloy that melts at less than 175C)? You may have delicate components that cannot withstand standard reflow temperatures,

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。