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镀锡纳米箔

Tin-coated NanoFoil® is not one, but two very different products, combined. It is a heat source and a form of solder. In the world of interconnection, this is quite unique. (Shown in the picture

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特殊原因和共同原因变异与旋钮操作:续

朋友们,让我们看看皮特是如何处理波峰焊危机的。皮特不得不承认,他对与弗雷德-卡塞尔会面的积极结果感到惊讶。那天,他给帕蒂发了一条短信

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激活 NanoFoil®

NanoFoil® is described as “reactive multilayer foil”. It is comprised of many alternating layers of aluminum and nickel which are each only nanometers thick. These layers are waiting in close

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Special Cause and Common Cause Variation and Knob Twiddling

Folks, It's been a while. Let's look in on Patty…… Patty stared, bleary eyed, at her laptop screen. It was the day after the election. She and Rob were following the election

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如何将导线焊接到焊盘上

这似乎是一件相当简单的事情。把导线焊接到焊盘上有什么难的?我听到过三种常见的抱怨和沮丧的表达方式:定位:通常情况下,在

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Optical Activation of NanoFoil®

Lasers and fiber optic waveguides can be used to activate NanoFoil®. Why would you want to use a laser to do this? It lends itself to automation: Imagine a part moving into position, the laser

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Can Your Mortality Be Modelled with The Weibull Distribution?

Folks, In the last posting, we saw how Weibull analysis helped us to determine that SACm® lead-free solder (SAC105 with about 0.1% manganese) has comparable (actually better) thermal cycle

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Weibull Analysis of Solder Joint Failure Data II

Derivation of the Weibull Graph Folks, Last time we introduced Weibull analysis. Let's now derive the relationships needed to calculate the slope, beta, and characteristic life, eta. F(t) is the

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铟密封件

Due to its softness and compressibility, indium is ideal for use in creating a seal. Let's get right into it: Indium preforms are commonly used to create seals. The preforms are made into an

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含铅和无铅焊点电子失效分析

Folks, The Weibull distribution is arguably the most important distribution in failure analysis of leaded and lead-free solder joints. It is the first thought of someone trying to model thermal

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Statistically Significant vs Practically Significant Results in SMT Assembly

Folks, Everyday, we are exposed to the results of surveys and polls. A typical example might be that President Obama is leading Mitt Romney in a poll by 48% to 45%, but the results are not

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A Look Inside the Solder Flux Pen

Here is a picture of an Indium Corporation solder flux pen, sectioned to show you the internals. Who DOESN'T want to see THAT, right?!? Flux pens are commonly used to accurately supply small

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生产力总是有回报的

Folks, Let’s see how Patty and Pete are making out on their latest adventure…. “Here is the ProfitPro™ output,” Dave Ferris said as he pointed to a PowerPoint slide on the

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Calculating Solder Paste Usage

Calculating the exact amount of solder paste needed for a given circuit board or for a full production run can be difficult for several reasons, including: print deposit variations paste left on the

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A Penny per Gram

Folks, It has been a while, let’s look in on Patty…… Patty had to admit that she was very fortunate. She had yet to turn 30 and she was a Senior Vice President at ACME. There was

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Cleaning No-Clean Solder Paste Residues in SMT Assembly

Folks, There is a lot of interest in cleaning PCBs that have been assembled with no-clean solder pastes. Recently I discussed the topic with my good friend Mike Bixenman of Kyzen. Dr. Ron (DR) Mike,

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水洗型焊膏助焊剂的SIR M测试

虽然我们很少收到关于水洗型/水溶性助焊剂或焊膏的SIR 表面绝缘电阻)和/或ECM(电化学迁移)测试结果的请求,但这类请求的频率也足够高,以至于

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旋转式溅射靶材 平面式溅射靶材的优缺点

有人问我,为什么有人会选择使用旋转式溅射靶材 平面溅射靶材

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锡须、焊料合金 密度、安全性:分享几点看法

Folks, Some time ago I wrote a post, “In Search of Tin Whiskers,” Michael responds below. He makes some good points. Dr. Ron, I'm responding to your blog regarding tin

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焊接中的低温有多低?

Do you ever have a need for a "low temperature" solder (meaning an alloy that melts at less than 175C)? You may have delicate components that cannot withstand standard reflow temperatures,

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The Interesting Physical Properties of Indium Metal

Solders, as a class, are "interesting" metals. And the properties of indium-containing solders are exceptionally interesting. Indium’s (and indium's alloys') physical and

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。