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Tin and Silver Use in Electronics after RoHS
Folks, In a recent posting we discussed that the higher melting temperatures of lead-free solder require reflow soldering temperatures to be higher, thus more electricity is used in lead-free
Is my unused indium sulfamate plating bath worth anything?
If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath
Colored Fluxes: Not Child’s-Play
One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix
A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells
Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newest low temp metallization paste LT-918.Due to its
Tin-Silver (SnAg) Solder Alloy for Stringing and Bussing Solar Modules
TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,
SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate
Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general
Flux Evaluation for AuSn High Temperature Solder Reflow
Recent test results show that solder fluxes handle high reflow temperatures (>450°C), providing better-than-expected visual results of flux residue! Solder fluxes have not traditionally been
Solving Solder Starvation in SMT Electronics Assembly
Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped
Humidity and Solder Paste Do Not Mix
Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with
Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations
Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t
Bismuth Solder Alloy Follow On
Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth
Has the Time Come for Tin-Bismuth Solders?
Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of
What is the best way to solder to Nitinol?
Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other
In Search of Tin Whisker Fails in Lead-Free Soldering
Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin
ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling
ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the
Electromigration (EM) and Electrochemical Migration (ECM)
I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of
Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?
Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and
Epoxy Flux Dipping for CSP and PoP Applications
This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have
It’s Wrong to Average or Add Cp and Cpk
Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick” of solder paste on the PWB pads. The product had
The Law of Exponential Profits
Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high volume products with a high mix. The first aspect of your
The Conclusion of “Bob and Fred Breaks”
Folks, The conclusion of the Bob and Fred break saga…… Phil stared, “The uptime on AXI’s four SMT production lines is…….” Fred and Bob were waiting for the good news of
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