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Uso di stagno e argento nell'elettronica dopo la RoHS

Gente, in un recente post abbiamo discusso del fatto che le temperature di fusione più elevate delle saldature senza piombo richiedono temperature di saldatura a riflusso più elevate, quindi viene utilizzata più elettricità nelle saldature senza piombo.

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Il mio bagno di galvanizzazione al solfammato di indio, che non ho utilizzato, ha qualche valore?

If you are left with an indium sulfamate plating bath or solution that you no longer use or need, you may have wondered what to do with it. It may be surprising to know that the indium plating bath

Prodotti

Colored Fluxes: Not Child’s-Play

One of the first activities any child enjoys, once they can manipulate things, is usingpaints and crayons to color pictures.Stay with me: there's a reason for this introduction. In the lastsix

Prodotti

A New Low-Temperature Metallization Paste For Interconnecting Thin-Film Solar Cells

Last week I spent some time in the Advanced Materials and Process Development Lab with Eric Bastow, verifying the printing characteristics of our newest low temp metallization paste LT-918.Due to its

Prodotti

Lega di saldatura stagno-argento (SnAg) per il collegamento delle stringhe e delle barre collettrici dei moduli solari

TypicalTabbing Ribbon Solders Only a few solder alloys have become common, industry-wide, among solarmodule assemblers, and those can be pared down into three categories: BiSn alloys (58Bi42Sn,

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SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate

Included in a solder paste‘s Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general

Prodotti

Valutazione del flusso per il riflusso di saldatura ad alta temperatura di AuSn

Recent test results show that solder fluxes handle high reflow temperatures (>450°C), providing better-than-expected visual results of flux residue! Solder fluxes have not traditionally been

Prodotti

Solving Solder Starvation in SMT Electronics Assembly

Solder starvation is a serious electronics assembly issue – with a very simple solution. Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped

Prodotti

Humidity and Solder Paste Do Not Mix

Unbeknowst to me, the refrigerator where I store my solder paste and fluxes that I use for SIR (Surface Insulation Resistance) testing was being moved. One of my colleagues showed up at my desk with

Prodotti

Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations

Based on a recent post I published regarding the use of bismuth (Bi)in solder alloys, John writes: "If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t

Prodotti

Bismuth Solder Alloy Follow On

Folks, A few people asked some questions after my last post on bismuth solders.Here they are: 1. The low melting point of these solders is encouraging.What are realistic field use conditions? Bismuth

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Has the Time Come for Tin-Bismuth Solders?

Folks, When the industry was preparing to transition to lead-free solders almost ten years ago (can it have been that long), tin-bismuth solders were serious candidates.Their low melting point, of

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Qual è il modo migliore per saldare al Nitinol?

Nitinol (a nickel titanium alloy) has become a very important material, especially in the medical world. It is often necessary to "attach" Nitinol to another piece of Nitinol or some other

Prodotti

Alla ricerca dei difetti del baffo di stagno nella saldatura senza piombo

Folks, In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly.In the minus category, I listed tin whiskers.A few people commented that tin

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ITO (Indium-Tin Oxide) Sputtering Target Reclaim/Recycling

ITO is one of the materials that makes the magic of flat panel displays (monitors, TVs, etc.) possible. When sputtered on in a thin layer, it acts as a transparent conductive film. However, the

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Elettromigrazione (EM) e migrazione elettrochimica (ECM)

I was asked this week to contribute to the upcoming IPC handbook (IPC-CH-65 HDBK) on the section on contamination and its effects on printed wiring assemblies (PWA’s). There is a clear crossover of

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Compatibility of Conformal Coatings versus No-Clean Solder Paste Flux Residues: When To Clean?

Conformal coating compatibility with no-clean flux residues has been a major topic for years – becoming even more popular recently with companies looking to cut manufacturing costs and

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Epoxy Flux Dipping for CSP and PoP Applications

This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package (PoP) device to be picked up from the dipping tray. Obviously, the vacuum nozzle must have

Prodotti

It’s Wrong to Average or Add Cp and Cpk

Folks, Patty had been working with engineering on a new product that needed a very precise and controlled volume of the stencil printed “brick” of solder paste on the PWB pads. The product had

Prodotti

The Law of Exponential Profits

Folks, Let’s assume you are trying to improve the productivity of your SMT assembly lines. You work at a facility that manufactures high volume products with a high mix. The first aspect of your

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The Conclusion of “Bob and Fred Breaks”

Folks, The conclusion of the Bob and Fred break saga…… Phil stared, “The uptime on AXI’s four SMT production lines is…….” Fred and Bob were waiting for the good news of

In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.