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Indium Corporation’s Tech Seconds video series features Phil Zarrow answering the electronics assembly industry’s most commonly asked questions… in less than 60 seconds. In this

Folks, It is accepted as fact by everyone that I know that 2/3rd of all SMT defects can be traced back to the stencil printing process. A number of us have tried to find a reference for this posit,

The topic of thermal management in electronics can get pretty complex. But, if the dissipation of the heat generated by your device isn’t considered in the initial design, you could be headed

I’m just back from Asia, where I had some good discussions with

Indium Corporation’s Tech Seconds video series features Phil Zarrow answering the electronics assembly industry’s most commonly asked questions… in less than 60 seconds. In this

Today we discuss the technology behind the paper: “Extreme Toughening of Soft Materials with Liquid Metal” with Dr. Navid Kazem. Dr. Kazem began his work with liquid metal-embedded

In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk

This week we learned about an exciting new liquid metal-infused polymer, made with a gallium-indium alloy, which can be used to form circuits that heal themselves after being damaged. Today, Eric

Over the last few days we have learned about how to create stretchable electronics from gallium and indium embedded into an elastomer. Today we continue the conversation with Eric Markvicka and look

We are back again with Eric Markvicka to talk about how easy it is to form a stretchable electrical circuit with liquid metal-embedded material and some simple tools. Jim: Eric, at first blush your

Yesterday Eric Markvicka demonstrated self-healing electronics for us with his video of a liquid metal embedded elastomer. Today, we discuss a composite material that is electrically insulating until

In past blog posts, I have talked about multiple applications for Indium Corporation’s Solder Fortification®Preforms where stronger solder joints are needed including edge connectors,

Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Phil Zarrow, discuss how vacuum reflow soldering can be used to reduce voiding. Phil Zarrow: Brook, there's been a

This week we will be discussing the future of self-healing electronics with Eric Markvicka of Carnegie Mellon University. At the time of writing this, Eric is a PhD Student working on his thesis:

In my last post, Stages of a Reflow Profile: Part I, I discussed how thespattering of solder balls and solder paste slumping can occur in the beginning stages of a reflow profile. In this post I will

A conversation with Phil Zarrow and Kimberly Flanagan, Technical Support Engineer. Phil Zarrow: Kim, why would I use flux-coated preform? Kimberly Flanagan: Indium Corporation uses a flux-coated

Folks, I thought I would take a short break from "Soldering 101"………. Whenpower weavinglooms swept England and the New England states in the early 1800s, many predicted a

Kimberly Flanagan, Technical Support Engineer, and Phil Zarrow discuss how Solder Fortification® Preforms can help reduce voiding and increase joint solder volume during PCB assembly. Phil

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

Your first consideration when determining how much flux to use in your solder wire is whether you are doing hand soldering or robotic soldering. Robotic soldering requires a greater flux percent than

Robert Ploessl, Manager of Marketing and Technology Assessment and Product Manager, Compounds, and Phil Zarrow examine how limited space on the factory floor can lead to material delivery