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Calcolo degli intervalli di confidenza sui Cpk
Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she
Gold-Tin Eutectic Solder
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach
Preforme a saldare rinforzate per un'elevata affidabilità e un basso livello di vuoto - Avanzamento tecnologico
Questo è il secondo di una serie di post sul blog che parla di preforme di saldatura rinforzate per un'alta affidabilità e un basso vuoto. Questo post si concentra sui progressi tecnologici di InFORMS®.
Project 99 Wave Solder Flux Performance Proof: Corrosion Testing
The corrosion test, also called the “copper mirror test,” differs from the copper coupon test because it qualitatively determines the corrosivity of the flux before reflow rather than
Project 99 Wave Solder Flux Performance Proof: Copper Coupon Testing
The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or
Project 99 Wave Soldering Performance Proof: J-Standard Testing
Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of
Project 99: Combating Icicles in SMT Wave Soldering
Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave
Consistent physical properties at cryogenic temperature: Use This Unique Indium Property to Your Advantage
Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use
Project 99: Combating Residue in Wave Soldering
The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively
Project 99: Combating Electro-migration in Wave Soldering
Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic
Indium Gaskets
Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The
Cpk is Still King in Evaluating an SMT Solder Paste Printing Process
Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but
Project 99: Combating Oxidation in Wave Soldering
Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d
Introducing Project 99: Wave Soldering Challenges Solved!
Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way
Placcatura all'indio
Indium Corporation fornisce anodi di placcatura all'indio e una soluzione per bagno di placcatura al solfammato di indio. Questi possono essere utilizzati con le apparecchiature di placcatura disponibili sul mercato o in un impianto casalingo. (Eric
Spiegazione dei "nove" relativi alla purezza del metallo
This post involves the purity of indium and all other metals and alloys. Some of my favorite topics to discuss are those which seem to ‘trip up’ readers who are learning something
SMT Stencil Design: Formula for Area Ratio of Elongated D
Folks, Ismail writes, Dr. Ron, I know that the area ratio for circular and square stencil apertures is 4d/t. What is it for an elongated “D” aperture? Thanks, Ismail. The area ratio of a
La RoHS dieci anni dopo: La transizione verso un assemblaggio elettronico senza piombo
Un po' di storia: la RoHS è una legge dell'Unione Europea. È l'acronimo di restrizione delle sostanze pericolose. Questa legge limita una manciata di sostanze chimiche nell'elettronica. In particolare, per chi lavora nel settore
Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)
Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the
Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)
Phil Zarrow: This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void™. Brook, let's talk a little bit about the
Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components
Autonomy, combined with greater customer demand for connectivity and media capability with vehicles, has caused the number of electronics within the automobile to dramatically rise. Or, as some have
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In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.

