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Cpks의 신뢰 구간 계산하기

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

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Gold-Tin Eutectic Solder

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

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높은 신뢰성과 낮은 보이드 발생을 위한 강화된 솔더 프리폼 | 기술 발전

이 블로그 게시물은 고신뢰성 및 낮은 보이드 발생을 위한 강화 솔더 프리폼에 대해 설명하는 시리즈 블로그 게시물 중 두 번째입니다. 이 게시물에서는 InFORMS®의 기술 발전에 초점을 맞출 것입니다.

지원

프로젝트 99 웨이브 솔더 플럭스 성능 검증: 부식 시험

“구리 거울 시험”이라고도 불리는 이 부식 시험은, 리플로우 전 플럭스의 부식성을 정성적으로 평가한다는 점에서 구리 쿠폰 시험과는 달리

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Project 99 Wave Solder Flux Performance Proof: Copper Coupon Testing

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

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Project 99 Wave Soldering Performance Proof: J-Standard Testing

Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of

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Project 99: Combating Icicles in SMT Wave Soldering

Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave

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극저온에서도 일관된 물리적 특성을 유지합니다: 인듐의 고유한 특성을 최대한 활용하세요.

Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use

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Project 99: Combating Residue in Wave Soldering

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

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Project 99: Combating Electro-migration in Wave Soldering

Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic

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Indium Gaskets

Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The

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Cpk is Still King in Evaluating an SMT Solder Paste Printing Process

Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but

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Project 99: Combating Oxidation in Wave Soldering

Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d

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Introducing Project 99: Wave Soldering Challenges Solved!

Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way

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인듐 도금

인디엄 코퍼레이션은 인듐 도금 양극과 인듐 설파메이트 도금 용액을 모두 공급합니다. 이러한 제품은 기성 도금 장비와 함께 사용하거나 직접 제작하여 사용할 수 있습니다. (Eric

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금속 순도에 관한 "나인"에 대한 설명

This post involves the purity of indium and all other metals and alloys. Some of my favorite topics to discuss are those which seem to ‘trip up’ readers who are learning something

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SMT Stencil Design: Formula for Area Ratio of Elongated D

Folks, Ismail writes, Dr. Ron, I know that the area ratio for circular and square stencil apertures is 4d/t. What is it for an elongated “D” aperture? Thanks, Ismail. The area ratio of a

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RoHS 10년 후: 무연 전자 조립으로의 전환

약간의 배경 지식을 말씀드리자면, RoHS는 유럽연합의 법률입니다. 유해 물질 제한을 의미합니다. 이 법은 전자제품에 사용되는 몇 가지 화학물질을 제한합니다. 가장 주목할 만한 것은

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Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)

Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the

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Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)

Phil Zarrow: This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void™. Brook, let's talk a little bit about the

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Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components

Autonomy, combined with greater customer demand for connectivity and media capability with vehicles, has caused the number of electronics within the automobile to dramatically rise. Or, as some have

Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.