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產品

計算 Cpks 的置信區間

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

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Gold-Tin Eutectic Solder

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

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高可靠性、低空洞的強化焊料預型件 | 技術進步

這是博文系列的第二篇,談論高可靠性和低空洞的強化焊料預型件。本篇文章將集中介紹 InFORMS® 的技術進展。

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Project 99 Wave Solder Flux Performance Proof: Corrosion Testing

The corrosion test, also called the “copper mirror test,” differs from the copper coupon test because it qualitatively determines the corrosivity of the flux before reflow rather than

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Project 99 Wave Solder Flux Performance Proof:銅銲條測試

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

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Project 99 Wave Soldering Performance Proof: J-Standard Testing

Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of

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Project 99: Combating Icicles in SMT Wave Soldering

Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave

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在低溫環境下仍具有穩定的物理特性:利用這種獨特的铟特性為您所用

Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use

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Project 99: Combating Residue in Wave Soldering

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

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Project 99: Combating Electro-migration in Wave Soldering

Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic

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Indium Gaskets

Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The

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Cpk is Still King in Evaluating an SMT Solder Paste Printing Process

Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but

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Project 99: Combating Oxidation in Wave Soldering

Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d

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Introducing Project 99: Wave Soldering Challenges Solved!

Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way

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鍍铟

Indium Corporation 提供鍍铟陽極和硫酸銨鍍槽溶液。這些產品可與現成的電鍍設備搭配使用,或用於自製設備。(艾瑞克

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關於金屬純度的 「九 」的解釋

This post involves the purity of indium and all other metals and alloys. Some of my favorite topics to discuss are those which seem to ‘trip up’ readers who are learning something

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SMT Stencil Design: Formula for Area Ratio of Elongated D

Folks, Ismail writes, Dr. Ron, I know that the area ratio for circular and square stencil apertures is 4d/t. What is it for an elongated “D” aperture? Thanks, Ismail. The area ratio of a

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RoHS 十年之後:向無鉛電子組裝的過渡

背景說明:RoHS 是歐盟的一項法律。它是限制有害物質的縮寫。這項法律限制電子產品中的一些化學物質。最值得注意的是,對於我們

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Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)

Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the

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Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)

Phil Zarrow: This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void™. Brook, let's talk a little bit about the

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Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components

Autonomy, combined with greater customer demand for connectivity and media capability with vehicles, has caused the number of electronics within the automobile to dramatically rise. Or, as some have

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。