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计算 Cpks 的置信区间

Let’s look in on Patty, it’s been awhile. Patty was looking forward to sleeping in. Normally she was up very early, sometimes before 5:30AM, after usually getting to bed too late, so she

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Gold-Tin Eutectic Solder

Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) isused in a varietyof applications requiring ahigh reliability, high melting solder joint. This includes die-attach and even lid-attach

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Reinforced Solder Preforms for High-Reliability and Low Voiding | Technology Advancement

This is the second in a series of blog posts that talks about Reinforced Solder Preforms for High–Reliability and Low Voiding. This post will focus on the technology advancement of InFORMS®

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Project 99 Wave Solder Flux Performance Proof: Corrosion Testing

The corrosion test, also called the “copper mirror test,” differs from the copper coupon test because it qualitatively determines the corrosivity of the flux before reflow rather than

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Project 99 Wave Solder Flux Performance Proof: Copper Coupon Testing

The copper coupon is a pretty simple test. A given amount of solder is reflowed onto a copper coupon with a specified amount of each flux. The test can be performed on either lead-free solder or

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Project 99 Wave Soldering Performance Proof: J-Standard Testing

Remember back when I said that our Project 99super heroes “aren’t just for fun – they really work?” As I shared, their characteristics have been identified using a battery of

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Project 99: Combating Icicles in SMT Wave Soldering

Icicles appear as stalactites hanging on the bottom of the circuit board during SMT wave

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Consistent physical properties at cryogenic temperature: Use This Unique Indium Property to Your Advantage

Most materials become brittle at very low temperatures, pure indium does not. It performs consistently at room and at extremely low temperatures. This property is why engineers across the world use

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Project 99: Combating Residue in Wave Soldering

The Alchemist (WF-9955) applies her sophisticated understanding of wave soldering flux ingredients and their interactions with metallizations to defeat Oxide, while at the same time effectively

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Project 99: Combating Electro-migration in Wave Soldering

Electro-migration is another common challenge encountered in wave soldering and can be cause by a number of factors: Chloride or other ionic residue on the bare board and/or components Hygroscopic

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铟垫片

Indium gaskets? You have probably heard of automotive head gaskets and plumbing gaskets and even gaskets used in sailing (that was a new one to me!). Buthave youheard of indium metal gaskets? The

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Cpk is Still King in Evaluating an SMT Solder Paste Printing Process

Folks, If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but

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Project 99: Combating Oxidation in Wave Soldering

Now that we’ve met our Project 99 heroes, it is important to understand their counterparts…the common villains that can wreak havoc during your wave soldering process. Today, I’d

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Introducing Project 99: Wave Soldering Challenges Solved!

Created in the Indium Corporation R&D labs, four exciting wave soldering fluxes – known as Project 99 – are ready to solve your challenges and save the world! Project 99 is a fun way

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镀铟

Indium Corporation supplies both Indium Plating Anodes and an Indium Sulfamate Plating Bath Solution. These can be used with off-the-shelf plating equipment, or used in a home-made setup. (Eric

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关于金属纯度 "九 "的解释

This post involves the purity of indium and all other metals and alloys. Some of my favorite topics to discuss are those which seem to ‘trip up’ readers who are learning something

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SMT Stencil Design: Formula for Area Ratio of Elongated D

Folks, Ismail writes, Dr. Ron, I know that the area ratio for circular and square stencil apertures is 4d/t. What is it for an elongated “D” aperture? Thanks, Ismail. The area ratio of a

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RoHS 十年之后:向无铅电子组装的过渡

背景介绍:RoHS 是欧盟的一项法律。它代表有害物质限制。该法律限制了电子产品中的少数化学物质。最值得注意的是,对于我们这些

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Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)

Phil Zarrow: This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the

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Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)

Phil Zarrow: This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void™. Brook, let's talk a little bit about the

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Automotive: Solder Paste Particle Size Effect on Voiding in Bottom-Terminated Components

Autonomy, combined with greater customer demand for connectivity and media capability with vehicles, has caused the number of electronics within the automobile to dramatically rise. Or, as some have

在Indium,我们致力于研究、开发和制造先进的电子组装材料 以应对当今、未来以及更长远的挑战。