Our materials enable the manufacture of strong, reliable products that endure the inevitable physical shocks and thermal stresses associated with electronics devices in applications from the Internet of Things (IoT) mobile devices to next-generation - low-energy servers – to automobile electronics.
Indium Corporation provides fluxes for:
- Package-on-package and fine-pitch component attach
- TCB and Cu-Pillar
Copper pillar/solder microbumps are emerging as a standard flip-chip solder bump replacement in many parts of the semiconductor assembly industry, from standard chip-attach to power devices using flip-chip on leadframe as assembly technologies. For logic and similar devices, substrate metallization (landing pad) technology has also shifted from solder-on-pad (SoP), manufactured from printed and reflowed and cleaned solder paste, to individual solder balls. The technology is now moving to simple organic solderability protectant (OSP) on copper.
Water-soluble fluxes, which may be applied by dipping or spraying, have long been used in flip-chip assembly, but their long history of utility is coming to a close as a number of factors makes the move to no-clean inevitable in the high-volume sub-130micron copper pillar era.ball-drop process.
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Flux Blog Posts
There are several questions that come up when learning about fluxes like, what does a flux do? How does a flux work? Why do I need a flux? Thi...
Quality is where it's at. Indium Corporation earns IATF 16949:2016 management system certificates for two manfacturing facilities and their corporate headquarters.
Indium Corporation is one of the first soldering materials suppliers to earn IATF-16949:2106 management system certificates for our Utica and Clinton facilities and company headquarters that produce products for automotive applications.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.