Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, Dec. 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
As the industry continues to embrace electrification, especially in automotive power modules and RF communication, a number of design challenges are emerging that impact the critical reliability performance for the final product. Uniform bondline thickness within assembly solder joints has a direct link to reliability, as an uneven bondline can result in early cracking and solder layer delamination. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Hertline will examine how InFORMS®, a reinforced matrix solder composite preform and ribbon (patent pending), delivers uniform bondline control with superior mechanical strength, enhancing reliability by a factor of 2X while achieving the lowest cost of ownership.
To register for the webinar, visit https://imaps.org/technical_webinarseries_9dece.php.
Hertline is the Product Manager for Engineered Solder Materials focusing on Power Electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. Most recently, he was focused on developing and supporting tactical radio communications products.
Si vous souhaitez obtenir davantage d'informations techniques de la part des experts d'Indium Corporation, inscrivez-vous à un prochain webinaire de la série InSIDER à l'adresse www.indium.com/webinar.
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected]. Vous pouvez également suivre nos experts, From One Engineer To Another® (#FOETA), sur www.facebook.com/indium ou @IndiumCorp.
