Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, Dec. 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
As the industry continues to embrace electrification, especially in automotive power modules and RF communication, a number of design challenges are emerging that impact the critical reliability performance for the final product. Uniform bondline thickness within assembly solder joints has a direct link to reliability, as an uneven bondline can result in early cracking and solder layer delamination. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Hertline will examine how InFORMS®, a reinforced matrix solder composite preform and ribbon (patent pending), delivers uniform bondline control with superior mechanical strength, enhancing reliability by a factor of 2X while achieving the lowest cost of ownership.
To register for the webinar, visit https://imaps.org/technical_webinarseries_9dece.php.
Hertline is the Product Manager for Engineered Solder Materials focusing on Power Electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. Most recently, he was focused on developing and supporting tactical radio communications products.
Wenn Sie an weiteren technischen Inhalten von Experten der Indium Corporation interessiert sind, registrieren Sie sich für ein kommendes Webinar der InSIDER-Serie unter www.indium.com/webinar.
Die Indium Corporation ist ein führender Materialveredler, -schmelzer, -hersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
Weitere Informationen über Indium Corporation finden Sie unter www.indium.com oder per E-Mail an [email protected]. Sie können auch unseren Experten, From One Engineer To Another® (#FOETA), unter www.facebook.com/indium oder @IndiumCorp folgen.
