Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test applications.
HSMF-OS is designed for high insertion capability. Its high tensile strength and soft compliant polymer backing allow it to survive multiple insertions. HSMF-OS has been tested to withstand over 5,000 insertion cycles without any loss of performance.
One of the challenges associated with a burn-in TIM is the attachment method. HSMF-OS has inherent adhesive properties on one side that allow for hand placement, removing the need for these additional steps and fixtures without compromising thermal performance. The opposite side is aluminum and it will not mark or stain the DUI (device under test).
HSMF-OS offers consistently good performance without phase change.
For more information on HSMF-OS and Indium Corporation’s full line of TIMs, visit indiumstg.wpenginepowered.com/TIMs.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
