Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan.
The seminar featured presentations by Sze Pei Lim, Indium Corporations technical manager for Southeast Asia, and Jason Chan, Kyzens technical applications manager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technologies.
Sze Pei is responsible for managing Indium Corporations technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an area technical manager. She earned her bachelors degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.
Chan has nine years of experience in semiconductor applications and electronics packaging assemblies, including wafer-bumping processes, flip-chip packaging, LED packaging, passive and hybrid components, PCB assembly applications, and more. He earned his bachelors degree in computer information systems from the University of Detroit Mercy in Mich., USA.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
