Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN.
Sandy-Smith will present the following papers:
- A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of a low-Ag SAC solder alloy doped with Mn (SACm™). SACm is compared to eutectic SnPb, SAC105, SAC305 alloys under various test conditions, such as JEDEC drop shock, dynamic bending, thermal cycling, and cyclic bending.
- Soldering Technologies Enabling Medical Device Packaging in the 3D Era. This paper will review the various forms of soldering for medical electronics and other types of medical devices. It examines how soldering technology is evolving to meet the challenges of smaller devices, which are more sensitive to manufacturing processes. Flux and similar materials that enable new assembly processes in the era of 2.5D and 3D technology will also be discussed.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures, des préformes et des flux, des brasures, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium et de germanium, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected].
