Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN.
Sandy-Smith will present the following papers:
- A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of a low-Ag SAC solder alloy doped with Mn (SACm™). SACm is compared to eutectic SnPb, SAC105, SAC305 alloys under various test conditions, such as JEDEC drop shock, dynamic bending, thermal cycling, and cyclic bending.
- Soldering Technologies Enabling Medical Device Packaging in the 3D Era. This paper will review the various forms of soldering for medical electronics and other types of medical devices. It examines how soldering technology is evolving to meet the challenges of smaller devices, which are more sensitive to manufacturing processes. Flux and similar materials that enable new assembly processes in the era of 2.5D and 3D technology will also be discussed.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure the best quality and selection of products. She earned two degrees from the international engineering program at the University of Rhode Island: one in chemical engineering with a focus on materials, the other in German language.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.
인듐 코퍼레이션(Indium Corporation)은 글로벌 전자, 반도체, 태양광, 박막 및 열 관리 시장에 소재를 공급하는 선도적인 제조업체이자 공급업체입니다. 주요 제품으로는 솔더, 프리폼, 플럭스, 브레이징 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄 금속 및 무기 화합물, 그리고 NanoFoil® 등이 있습니다. 1934년에 설립된 인듐 코퍼레이션은 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 싱가포르, 한국, 영국, 미국에 공장을 운영하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다.
