Several Indium Corporation technology experts will present at IPC APEX March 25 – 27 in Las Vegas, Nevada.
Dr. Ning-Cheng Lee, vice president of technology, will give two presentations. His first presentation, Low Cost High Reliability Assembly of POP with a Novel Epoxy Flux on Solder Paste, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.
Dr. Lee’s second presentation, Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloys in BGA Assembly, reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
Tim Jensen, senior product manager for engineered solders, will teach a professional development course entitled Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges. This course will cover many of the factors that contribute to the three most challenging lead-free assembly defects and how to optimize processes and material to reduce the potential for these issues. It also includes a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past.
Dr. Andy Mackie, senior product manager for semiconductor assembly materials, will present Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices. This presentation explores emerging materials, processes, and failure modes in evanescent materials relevant to waferlevel packaging, ball-grid array, flip-chip, as well as 2.5D and 3D. It will also discuss critical caps in criteria for quantifying materials performance that needs to be addressed as the industry expands into the era of dimensional 2.5D and 3D devices.
Eric Bastow, assistant technical manager, will present The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. In his presentation, Bastow will talk about the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004[1] surface insulation resistance (SIR) testing using both halogen-free (ROL0) and halogen-containing (ROL1) Pb-free no-clean solder paste.
Additionally, several Indium Corporation technology experts have been selected to give poster presentations and serve as session chairs.
Le Dr Lee est un expert en brasage de renommée mondiale et un membre de distinction de la SMTA. Il possède une vaste expérience dans le développement de polymères à haute température, d'encapsulants pour la microélectronique, de sous-remplissages et d'adhésifs. Ses recherches actuelles portent sur les matériaux avancés pour les interconnexions et l'emballage pour les applications électroniques et optoélectroniques, en mettant l'accent sur la haute performance et le faible coût de possession.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Andy has a doctorate in physical chemistry from the University of Nottingham, UK, and a master of science (MSc) in colloid and interface science from the University of Bristol, UK. Additionally, he is formally trained in Six Sigma – Design of Experiments.
M. Bastow assure l'assistance technique pour la gamme complète de produits de brasage d'Indium Corporation destinés aux marchés de l'assemblage électronique, des boîtiers de semi-conducteurs et de la gestion thermique. Il est ingénieur process certifié et a obtenu son Six Sigma Green Belt à la Thayer School of Engineering du Dartmouth College. M. Bastow est un spécialiste certifié des normes IPC-A-600 et 610D.
For more information about the presentations or to register for the conference, visit www.ipcapexexpo.org.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
