Several Indium Corporation technology experts will present at IPC APEX March 25 – 27 in Las Vegas, Nevada.
Dr. Ning-Cheng Lee, vice president of technology, will give two presentations. His first presentation, Low Cost High Reliability Assembly of POP with a Novel Epoxy Flux on Solder Paste, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.
Dr. Lee’s second presentation, Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloys in BGA Assembly, reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
Tim Jensen, senior product manager for engineered solders, will teach a professional development course entitled Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges. This course will cover many of the factors that contribute to the three most challenging lead-free assembly defects and how to optimize processes and material to reduce the potential for these issues. It also includes a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past.
Dr. Andy Mackie, senior product manager for semiconductor assembly materials, will present Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices. This presentation explores emerging materials, processes, and failure modes in evanescent materials relevant to waferlevel packaging, ball-grid array, flip-chip, as well as 2.5D and 3D. It will also discuss critical caps in criteria for quantifying materials performance that needs to be addressed as the industry expands into the era of dimensional 2.5D and 3D devices.
Eric Bastow, assistant technical manager, will present The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. In his presentation, Bastow will talk about the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004[1] surface insulation resistance (SIR) testing using both halogen-free (ROL0) and halogen-containing (ROL1) Pb-free no-clean solder paste.
Additionally, several Indium Corporation technology experts have been selected to give poster presentations and serve as session chairs.
Dr. Lee ist ein weltweit anerkannter Lötexperte und ein SMTA Member of Distinction. Er verfügt über umfangreiche Erfahrungen in der Entwicklung von Hochtemperaturpolymeren, Verkapselungsmitteln für die Mikroelektronik, Underfills und Klebstoffen. Sein derzeitiges Forschungsinteresse gilt fortschrittlichen Materialien für Verbindungen und Gehäuse für elektronische und optoelektronische Anwendungen, wobei der Schwerpunkt auf hoher Leistung und niedrigen Betriebskosten liegt.
Jensen is an SMTA-certified process engineer. He earned his bachelor’s degree in chemical engineering from Clarkson University. He has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as head-in-pillow, graping, and QFN voiding. Through his direct work on hundreds of SMT lines, he understands each customer’s unique requirements and readily shares his expertise by authoring technical papers and writing for technical publications. He also participates actively in several IPC standards development committees.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has over 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Andy has a doctorate in physical chemistry from the University of Nottingham, UK, and a master of science (MSc) in colloid and interface science from the University of Bristol, UK. Additionally, he is formally trained in Six Sigma – Design of Experiments.
Bastow bietet technische Unterstützung für die gesamte Palette der Lötprodukte der Indium Corporation für die Märkte Elektronikmontage, Halbleitergehäuse und Wärmemanagement. Er ist ein zertifizierter Prozessingenieur und hat seinen Six Sigma Green Belt an der Thayer School of Engineering am Dartmouth College erworben. Bastow ist ein zertifizierter IPC-A-600 und 610D Spezialist.
For more information about the presentations or to register for the conference, visit www.ipcapexexpo.org.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Indium wurde 1934 gegründet und verfügt über einen weltweiten technischen Support und Fabriken in China, Singapur, Südkorea, Großbritannien und den USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
