Indium Corporations Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.
Dr. Lee will teach two professional development courses. His first course, Electromigration the Hurdle for Miniaturization and High Power Devices, examines the electromigration phenomenon in miniaturized electronics, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, composition, volume, the resistance of solder joints, and more.
Dr. Lees second course, Achieving High Reliability of Lead-Free Soldering Materials Consideration, talks about materials considerations required for achieving high-reliability lead-free solder joints. Emphasis is placed on understanding how various factors contribute to failure modes and how to select the proper solder alloys and surface finishes to achieve high-reliability.
Sze Pei will present Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys. Her presentation explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.
Sehar will present The Second Generation Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn. This presentation discusses the considerable improvement in shock resistance and thermal fatigue performance of a new solder alloy doped with Mn.
For more information about these presentations or to register for the conference, visit www.smta.org/southeast-asia.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Sze Pei is responsible for managing Indium Corporations technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an Area Technical Manager. She earned her bachelors degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.
Sehar provides field technical support to Indium Corporations customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected].
