Indium Corporation will feature its proven, innovative products for LED manufacturing at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.
Indium Corporation produces a wide range of products to meet the current and evolving needs of the industry. As mini-LEDs are increasingly used in displays for consumer electronics at home and in external displays due to their superior contrast ratios, deep blacks, and high dynamic ranges.
Indium Corporations suite of semiconductor and advanced assembly materials is ideal for Mini-LED assembly and the small pad sizes and tight pitches required in their assembly.
Les solutions de pâte à souder présentées sont les suivantes :
- LEDPaste NC38HF, a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. This new product will be released at the show and combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.
- Indium12.8HF, a no-clean, halogen-free microdispensing solder paste that is inherently compatible with Indium Corporations best-selling solder pasteIndium8.9HFand is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80m.
- Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporations Type 6 SGS powder is ideal for fine feature printing applications. It also offers consistent, repeatable printing performance combined with a long stencil life.
Les solutions de Flux qui seront présentées sont les suivantes
- NC-809, an award-winning, halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
- WS-829 is a wafer-level ball-attach flux is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard BGA manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging. It is designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
- LED TACFlux 007 is the leading die-attach flux for LED industry. Specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, it provides melting points that range from tin-silver (SnAg), SAC (SnAgCu) and pure tin (Sn) up to gold-tin (AuSn) eutectic. It may be applied using various application techniques, holds the die in place during reflow, and is easily cleaned to give high wire bond pull-strengths.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), sur www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
