Indium Corporation will feature its proven, innovative products for LED manufacturing at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.
Indium Corporation produces a wide range of products to meet the current and evolving needs of the industry. As mini-LEDs are increasingly used in displays for consumer electronics at home and in external displays due to their superior contrast ratios, deep blacks, and high dynamic ranges.
Indium Corporations suite of semiconductor and advanced assembly materials is ideal for Mini-LED assembly and the small pad sizes and tight pitches required in their assembly.
Solder paste solutions to be featured include:
- LEDPaste NC38HF, a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. This new product will be released at the show and combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.
- Indium12.8HF, a no-clean, halogen-free microdispensing solder paste that is inherently compatible with Indium Corporations best-selling solder pasteIndium8.9HFand is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80m.
- Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporations Type 6 SGS powder is ideal for fine feature printing applications. It also offers consistent, repeatable printing performance combined with a long stencil life.
Flux solutions to be featured include:
- NC-809, an award-winning, halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
- WS-829 is a wafer-level ball-attach flux is a water-soluble, halogen-free flux that can be used for ball-attach on substrate in a standard BGA manufacturing process (especially for the smallest sphere applications < 0.25mm) as well as wafer-/panel-level packaging. It is designed for printing and pin transfer applications for the smallest sphere and high-density applications, including LED die-attach.
- LED TACFlux 007 is the leading die-attach flux for LED industry. Specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, it provides melting points that range from tin-silver (SnAg), SAC (SnAgCu) and pure tin (Sn) up to gold-tin (AuSn) eutectic. It may be applied using various application techniques, holds the die in place during reflow, and is easily cleaned to give high wire bond pull-strengths.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
