As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 1316, in Fountain Hills, AZ.
Indium Corporation’s proven SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. The newly released SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
As the industry leader in no-clean semiconductor flux, Indium Corporation will feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
Indium Corporation will also feature Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
Additionally, Indium Corporation will showcase QuickSinter, a high metal content paste, redefining sinter technology. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
Pour en savoir plus sur les solutions innovantes d'Indium Corporation pour HIA et SiP, visitez nos experts sur le stand #56 à la conférence IMAPS Device Packaging ou en ligne sur indium.com/HIA.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
À propos d'IMAPS
L'International Microelectronics Assembly and Packaging Society (IMAPS) est la plus grande société dédiée à l'avancement et à la croissance des technologies de la microélectronique et de l'emballage électronique par le biais de la formation professionnelle. Le portefeuille de technologies de la société est diffusé par le biais d'événements professionnels de premier plan, d'une bibliothèque de recherche exclusive sur l'emballage microélectronique, de réseaux de sections locales et d'autres efforts. Fondée en 1967 sous le nom d'ISHM, puis fusionnée avec l'International Electronic and Packaging Society (IEPS) en 1996, la société a plus de 50 ans d'expérience en matière de réseaux, d'éducation et de publications.
