As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 1316, in Fountain Hills, AZ.
Indium Corporation’s proven SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. The newly released SiPaste C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.
As the industry leader in no-clean semiconductor flux, Indium Corporation will feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
Indium Corporation will also feature Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
Additionally, Indium Corporation will showcase QuickSinter, a high metal content paste, redefining sinter technology. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
インジウム・コーポレーションのHIAおよびSiP向け革新的ソリューションの詳細については、IMAPSデバイス・パッケージング・カンファレンスのブース#56、またはオンラインのindium.com/HIAで当社のエキスパートをご覧ください。
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家であるFrom One Engineer To Another (#FOETA)を、www.linkedin.com/company/indium-corporation/または@IndiumCorp でフォローすることもできます。
IMAPSについて
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
