Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9—5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Heating PCBs for soldering can potentially lead to substrate and component warpage, causing parts to expand and contract, and leading to common soldering defects such as HIP/HOP and non-wet opens. High-temperature, lead-free soldering has exacerbated these problems. To help solve these issues, interest in low-temperature solders for reflow and selective soldering has grown. However, not all companies have the ability to change the alloys they use. Willis will provide practical insights for common—and not so common—soldering and assembly problems relating to warpage. Some of the solutions, as well as “shop floor tricks,” will also be illustrated.
Subjects covered in this webinar will include:
- PCB substrate warpage
- Component package warp
- Connector lifting
- QFP pin opens
- Process simulation and inspection methods
- BGA solder shorts and opens
- Missing pins
La série InSIDER d'Indium Corporation est un programme gratuit conçu pour fournir un contenu technique expert, partager les connaissances de l'industrie et promouvoir la croissance professionnelle à l'aide d'une plate-forme virtuelle. Les webinaires actuels et futurs sont disponibles à l'adresse suivante : www.indium.com/webinar.
Willis is an England-based trainer and consultant with more than 30 years of experience working with companies implementing surface mount technology (SMT) and area array technology, as well as most areas of electronics manufacturing.
To register for Willis’ webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected]. Vous pouvez également suivre nos experts, From One Engineer To Another® (#FOETA), sur www.facebook.com/indium ou @IndiumCorp.
