Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.
The arrival of lead-free soldering in SMT assembly forced peak reflow temperatures to increase by as much as 40C over those of tin-lead soldering. This requirement was driven by SAC305, the most common lead-free solder, having a melting temperature of about 220C, 37C above tin-lead’s 183C. These higher reflow temperatures can stress the components and printed wiring board (PWB) as both are composed of polymer materials.
Dr. Lasky’s presentation will review the tin-bismuth research and summarize its conclusions. He will also include an overview of a new alloy technology which employs two constituents with different melting points to create a unique solder with outstanding mechanical properties.
“Considerable effort has been made to develop lead-free solders with lower melting temperatures; however, the resulting tin-bismuth solders have generally performed poorly in drop shock testing despite their success in thermal cycle testing,” said Dr. Lasky. “I want to thank the SMTA for entrusting me with the forum to share my insights and help drive our industry forward.”
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. He has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics such as electronics packaging, materials science, physics, mechanical engineering, and science and religion.
M. Lasky détient de nombreux brevets et est le développeur de plusieurs logiciels de traitement SMT relatifs à l'estimation des coûts, à l'équilibrage des lignes et à l'optimisation des processus. Il est le co-créateur d'examens de certification d'ingénierie qui établissent des normes dans l'industrie de l'assemblage électronique à l'échelle mondiale. M. Lasky a reçu le prix de distinction technique de la Surface Mount Technology Association (SMTA) en 2021 pour ses "contributions techniques significatives et continues à la SMTA". Il a également reçu le prestigieux prix du fondateur de la SMTA en 2003.
À propos d'Indium Corporation
Indium Corporation est un raffineur, un fondeur, un fabricant et un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques d'indium, de gallium, de germanium et d'étain, ainsi que des feuilles NanoFoil. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à Jingya Huang. Vous pouvez également suivre nos experts, From One Engineer To Another (#FOETA), sur www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
About SMTA
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.
