Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.
The arrival of lead-free soldering in SMT assembly forced peak reflow temperatures to increase by as much as 40C over those of tin-lead soldering. This requirement was driven by SAC305, the most common lead-free solder, having a melting temperature of about 220C, 37C above tin-lead’s 183C. These higher reflow temperatures can stress the components and printed wiring board (PWB) as both are composed of polymer materials.
Dr. Lasky’s presentation will review the tin-bismuth research and summarize its conclusions. He will also include an overview of a new alloy technology which employs two constituents with different melting points to create a unique solder with outstanding mechanical properties.
“Considerable effort has been made to develop lead-free solders with lower melting temperatures; however, the resulting tin-bismuth solders have generally performed poorly in drop shock testing despite their success in thermal cycle testing,” said Dr. Lasky. “I want to thank the SMTA for entrusting me with the forum to share my insights and help drive our industry forward.”
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. He has authored six books and contributed to nine others on science, electronics, and optoelectronics; he has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics such as electronics packaging, materials science, physics, mechanical engineering, and science and religion.
Dr. Lasky ist Inhaber zahlreicher Patente und Entwickler mehrerer Softwareprodukte für die SMT-Bearbeitung in den Bereichen Kostenkalkulation, Linienabgleich und Prozessoptimierung. Er ist Mitbegründer von technischen Zertifizierungsprüfungen, die weltweit Standards in der Elektronikmontagebranche setzen. Dr. Lasky wurde im Jahr 2021 mit dem Technical Distinction Award der Surface Mount Technology Association (SMTA) für seine "bedeutenden und kontinuierlichen technischen Beiträge zur SMTA" ausgezeichnet. Außerdem wurde er 2003 mit dem prestigeträchtigen Founder's Award der SMTA ausgezeichnet.
Über Indium Corporation
Die Indium Corporation ist ein führender Materialveredler, -schmelzer, -hersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Deutschland, Indien, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den Vereinigten Staaten.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an Jingya Huang. Sie können auch unseren Experten, From One Engineer To Another (#FOETA), unter www.linkedin.com/company/indium-corporation/ oder @IndiumCorp folgen.
About SMTA
SMTA is an international network of professionals who build skills, share practical experience and develop solutions in Electronics Manufacturing (EM), including microsystems, emerging technologies, and related business operations.
