Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Sze Pei’s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.
Sehar’s presentation, Alternate Lead-Free Soldering Alloy, discusses a variety of alternative Pb-free soldering alloys, including the mainstream SAC305, and compares them against the benchmark eutectic SnPb solders.
Sze Pei est responsable de la gestion des équipes techniques d'Indium Corporation dans la région Asie-Pacifique. Elle a rejoint Indium Corporation en 2007 en tant que responsable technique régional. Elle est titulaire d'une licence en chimie de l'Université nationale de Singapour et possède 17 ans d'expérience dans les secteurs de l'assemblage SMT et PCB.
Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in customer factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
The IPC Conference on Assembly and Reliability focuses on practical methodologies that can be developed today, providing critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology, testing strategies, and materials compliance. Focused presentations will address strategic reliability considerations related to solder alloys and the latest packaging technologies – targeting issues such as void formation and electrochemical migration – and offer risk mitigation processes and data analysis.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
