Indium Corporation’s Sze Pei Lim, Technical Manager – Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Sze Pei’s presentation, Optimizing Void Performance of QFN Assembly, explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.
Sehar’s presentation, Alternate Lead-Free Soldering Alloy, discusses a variety of alternative Pb-free soldering alloys, including the mainstream SAC305, and compares them against the benchmark eutectic SnPb solders.
施佩负责管理铟泰公司在亚太地区的技术团队。她于2007年加入铟泰公司 ，担任区域技术经理。她拥有新加坡 国立大学化学学士学位，并在表面贴装技术 和PCB 封装行业拥有17年的从业经验。
Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in customer factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
The IPC Conference on Assembly and Reliability focuses on practical methodologies that can be developed today, providing critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology, testing strategies, and materials compliance. Focused presentations will address strategic reliability considerations related to solder alloys and the latest packaging technologies – targeting issues such as void formation and electrochemical migration – and offer risk mitigation processes and data analysis.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
