Communiqués de presse

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature

Indium Corporation will feature an array of innovative thermal management solutions at SEMI-THERM, March 1317, in San Jose, CA.   Indium Corporation’s new line of innovative

The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 1317 in San Jose,

Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S. As an industry leader in high-performance metal

Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).   In this role, Hartnett pursues

Indium Corporation will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2023,

Indium Corporation‘s Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the

Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the companys China Country Sales Manager.  In this role, Wang leads the China sales team and is responsible for all sales

Indium Corporation will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its flux-cored wire, CW-818. The award was presented during a ceremony

Indium Corporation is pleased to announce the formation of a strategic partnership with two materials distributors in Europe to better serve the companys customers in Sweden, Denmark, and

Indium Corporation, through coordination with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 2426 in San Diego,

Indium Corporation will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January

Indium Corporation‘s technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal

Indium Corporation will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at IPC APEX Expo, Jan. 24-26, in San Diego, Calif., US.

Indium Corporation is pleased to announce the addition of Srinevassa Ramsundar as Plant Manager at its Chicago facility. Ramsundar ensures that Indium Corporations Chicago facility and personnel