Communiqués de presse

Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability. Indalloy303, also

Indium Corporation‘s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics

Indium Corporation is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge

Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto,

Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation‘s EV InSIDER Live webcast series is set

As one of the industry’s foremost providers of Au-based products, Indium Corporation will proudly feature its high-temperature and high-reliability gold solder solutions

Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.   The arrival of

Indium Corporation‘s Brian O’Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in

Indium Corporation‘s Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous

Indium Corporation‘s Brian O’Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA

Indium Corporation Regional Technical Manager and Technologist Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in

Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to

Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature

Indium Corporation will feature an array of innovative thermal management solutions at SEMI-THERM, March 1317, in San Jose, CA.   Indium Corporation’s new line of innovative

The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 1317 in San Jose,

Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology