Comunicados de prensa

Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto,

Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation‘s EV InSIDER Live webcast series is set

As one of the industry’s foremost providers of Au-based products, Indium Corporation will proudly feature its high-temperature and high-reliability gold solder solutions

Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.   The arrival of

Indium Corporation‘s Brian O’Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in

Indium Corporation‘s Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous

Indium Corporation‘s Brian O’Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA

Indium Corporation Regional Technical Manager and Technologist Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in

Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to

Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation will feature

Indium Corporation will feature an array of innovative thermal management solutions at SEMI-THERM, March 1317, in San Jose, CA.   Indium Corporation’s new line of innovative

The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 1317 in San Jose,

Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S. As an industry leader in high-performance metal

Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).   In this role, Hartnett pursues

Indium Corporation will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2023,

Indium Corporation‘s Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the