Communiqués de presse

Indium Corporation, Utica’s Technology Company, is pleased to announce Kay Parker, Quality Engineering Applications Specialist, has been appointed to the Board of Trustees of The Community

Indium Corporations Kim Flanagan, Technical Support Engineer, will host an InSIDER Series webinar on reflow fundamentals in two sessions on Wednesday, Feb. 10 at 9 a.m. Eastern Time (2 p.m.

Indium Corporation announces that it is now offering CW-232, a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter

Indium Corporations Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Series webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at

Indium Corporations Dr. HongWen Zhang, R&D Manager, Alloy Group, will host webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 19 at 10 a.m. Eastern

Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series

Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser,

Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, Dec. 9

Indium Corporation’s Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization roundtable hosted by BarTron on Thursday, Dec. 10 at 10 a.m.

Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday,

Indium Corporation and Valuetronics International have formed a strategic partnership to serve customers in the Americas with its cored wire, rework fluxes, and bar solder products.

Indium Corporation earned BISinfotech’s BETA Award for Global Innovative Solder Paste Solutions Provider of the Year on Friday, October 30 during a virtual

Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS’s online thermal management conference from Nov.

Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in

Indium Corporation’s Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, participated in a soldering-focused webinar hosted

Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system. The Mexico Technology Awards, sponsored by Mexico

Indium Corporation earned Electronics Maker’s Best of Industry Award for ‘Excellence in Electronics Assembly Materials’ on Thursday, October 15 during a virtual ceremony.

Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT),

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Conference, November 8-10, TianShui City, China.

Indium Corporation offers high-purity indium metal as a quality starting material for all indium-based compound semiconductor substrates. Indium Corporation’s high-purity indium