Communiqués de presse

Indium Corporation's Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of

Indium Corporation’s Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, will host an InSIDER Series webinar regarding the implementation of

Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will host a 45-minute Thermal LIVE™ webinar on Oct. 20 at 10 a.m. Eastern/7:00 a.m.

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present technical content during IMPACT-EMAP 2020, Oct. 21-23. 

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will be one of five workshop trainers at the Electronic Packaging Convention Asia 2020 (EPCON Asia), Oct.

Indium Corporation’s David Sbiroli, R&D Senior Technologist, will participate in a Global SMT & Packaging debate on advanced print and paste deposition techniques on

Indium Corporation is offering a free presentation for students and young professionals to expand their industry knowledge of reflow basics during the virtual exposition at SMTA

Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.

Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications,

Four Indium Corporation experts will share their industry knowledge and expertise during a live virtual exposition at SMTA International from Sept. 28-30. The following technical

Indium Corporation’s Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in

Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their

Indium Corporation’s Joseph Hertline, Product Manager – ESM/Power Electronics, will present on materials solutions for high-reliability power electronics assembly during CHARGED

Indium Corporation’s Chris Nash, Product Manager, PCB Assembly Materials, will participate in a Global SMT & Packaging voiding panel on Tuesday, Sept. 8 at 10:45

Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice

Indium Corporation will feature its precision AuSn preforms for high-reliability aerospace applications during the Space Tech Expo Connect virtual exhibition from Aug. 10-13. Aerospace

Indium Corporation, Utica’s Technology Company®, provides an annual internship opportunity to local college students, which offers a summer experience that is not your average

Indium Corporation will feature its precision materials for high-reliability 5G communications during the International Microwave Symposium (IMS) virtual exhibition from Aug. 4-6.

Indium Corporation’s Miloš Lazi, Technical Support Engineer, will host an InSIDER Series webinar focused on liquid metal thermal interface materials. There will be two sessions