Comunicados de prensa

Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system. The Mexico Technology Awards, sponsored by Mexico

Indium Corporation earned Electronics Maker’s Best of Industry Award for ‘Excellence in Electronics Assembly Materials’ on Thursday, October 15 during a virtual ceremony.

Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT),

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Conference, November 8-10, TianShui City, China.

Indium Corporation offers high-purity indium metal as a quality starting material for all indium-based compound semiconductor substrates. Indium Corporation’s high-purity indium

Indium Corporation’s Sze Pei Lim, Regional Product Manager, will host an InSIDER Series webinar on soldering material technology for heterogeneous integration on Webex at 8:30 a.m.

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the virtual EPP InnovationsFORUM Germany on Oct. 28 at

Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China. Low-temperature soldering is not a

Indium Corporation’s Claire Hotvedt, Product Development Specialist, has been honored by the Genesis Group’s 15th Annual Striving for Success Program. The program

Indium Corporation has released a new high-reliability alloy with enhanced thermal cycling performance specially formulated for harsh environments. Indalloy®292 is an innovative

Indium Corporation's Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of

Indium Corporation’s Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, will host an InSIDER Series webinar regarding the implementation of

Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will host a 45-minute Thermal LIVE™ webinar on Oct. 20 at 10 a.m. Eastern/7:00 a.m.

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present technical content during IMPACT-EMAP 2020, Oct. 21-23. 

Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will be one of five workshop trainers at the Electronic Packaging Convention Asia 2020 (EPCON Asia), Oct.

Indium Corporation’s David Sbiroli, R&D Senior Technologist, will participate in a Global SMT & Packaging debate on advanced print and paste deposition techniques on

Indium Corporation is offering a free presentation for students and young professionals to expand their industry knowledge of reflow basics during the virtual exposition at SMTA

Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.

Indium Corporation has released a new ball-attach flux, WS-829, designed for printing and pin transfer applications for the smallest sphere and high-density applications,

Four Indium Corporation experts will share their industry knowledge and expertise during a live virtual exposition at SMTA International from Sept. 28-30. The following technical

Indium Corporation’s Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in