Communiqués de presse

In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo,

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is hosting a half-day, reliability-focused technical symposium at SMTA Dallas on July 24

Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the June Argus US Specialty Metals conference in Chicago, Illinois,

Indium Corporation’s Dave Sbiroli, Technical Support Manager, will share his industry insight at the SMTA Upper Midwest Expo & Tech Forum, June 27, Minneapolis, Minnesota,

Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Huizhou Seminar on June 27 in Huizhou, China. Liang’s

Indium Corporation expert Pony Liao, Area Technical Manager, Northern China will share his technical expertise at IPC WorksAsia Automotive Electronics High-Reliability

Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders,will present at the International Conference and Exhibition on High Temperature

Indium Corporation, CONMED Corporation, Utica National Insurance Group, and Assured Information Security (AIS) joined together to co-sponsor the first annual "Utica Starts

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean

Indium Corporation experts will share their technical expertise at a seminar for Manufacturing and Processes for High-Reliability and System-in-Package Applications on June 14 in

In celebration of Indium Corporation's 85th anniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package

Indium Corporation experts will share their knowledge at the International Conference for Electronics Enabling Technologies (ICEET), June 4-6, Markham, Ontario.  Ed Briggs,

Indium Corporation's line of gold-based solder paste is used in a variety of high-reliability applications. Gold-based solder pastes offer numerous benefits, such as high tensile strength,

Indium Corporation's Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology Conference &

Indium Corporation announces that it is now offering ultrafine flux-cored wire down to 0.006” (0.15mm) in diameter for standard Pb-free

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, has been elected to the Minor Metals Trade Association (MMTA) board of directors and was named interim

Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA. Homer