Pressemitteilungen

Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference, September 16-19,

Indium Corporation’s Jason Chou, Area Technical Manager – Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan. Chou will present Challenges

Four Indium Corporation experts will present at SMTA International, September 22-26, in Rosemont, Illinois, USA. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a

Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei,

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in

Indium Corporation, in cooperation with industry partners MicroCare and Weller, will host a half-day, reliability-focused technical symposium at SMTA Atlanta on

Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston,

In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise

Indium Corporation will feature its Indium8.9HF Solder Paste at Productronica India, September 25-27, in Greater Noida, Delhi National Capital Region, India.  Indium8.9HF is

Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material that is

Indium Corporation will feature its ultra-reliable, void-reducing Indium8.9HF Solder Paste for automotive applications at SMTA International, September 22-26, Rosemont, Illinois,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise at the 20th International Conference on Electronic Packaging Technology (ICEPT

Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September

Indium Corporation will feature its “no-spatter” flux-cored wire, Core 230-RC, at SMTA International, September 22-26, in Rosemont, Illinois, USA. Indium Corporation’s

Indium Corporation will feature its ultra-reliable Indium8.9HF-1 Solder Paste at NEPCON Asia, August 28-30, in Shenzhen, China.  Indium Corporations Indium8.9HF-1 is

Indium Corporation will feature its proven Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28-30 in Taipei, Taiwan.  The use of

In celebration of Indium Corporation’s 85thanniversary, the company will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo,

Indium Corporation, in cooperation with industry partners MicroCare and Weller, is hosting a half-day, reliability-focused technical symposium at SMTA Dallas on July 24

Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the June Argus US Specialty Metals conference in Chicago, Illinois,