Communiqués de presse

Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications,

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will present at SVC TechCon 2019, April 30-May 1, Long Beach, California, USA. Vareha-Walsh’s

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the12th World Indium, Bismuth, Germanium, and Gallium Forum, March 14-15, Zhuhai,

Indium Corporation, Utica’s Technology Company®, welcomes Tyler Hutchinson to its team.  Hutchinson has joined Indium Corporation as a Product Specialist. He is responsible for

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at Fastmarkets' 20th Asian Ferroalloys Conference, March

Indium Corporation experts Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will

Two Indium Corporation experts will present during PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.  Seth Homer, Product Manager Engineered Solders, will present The

Indium Corporation has released TACFlux® 066HF, a new water-soluble halogen-free (ORH0) hand soldering and rework flux.   TACFlux® 066HF is compatible with typical Sn/Pb

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach

Three Indium Corporation experts willshare their expertise at the SMTA China East Technology Conference on April 24-26 in Shanghai, China. Wisdom Qu, Area Tech Manager, Eastern

Indium Corporation has released m2TIMTM– a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.

CLINTON, NY – Indium Corporation employees throughout the Mohawk Valley joined their counterparts around the world in celebration today, marking the company’s 85thanniversary.

CLINTON, NY – Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary. Indium Corporation was founded in 1934 in

Indium Corporation is participating in Productronica China’s newest live program on the show floor, which offers attendees a combined independent exhibition booth and product line

Indium Corporation will feature its new Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at Productronica China, March 20-22, in Shanghai,

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.  The Indium8.9HF series is an air

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg,

Indium Corporation will feature its new reinforced matrixed solder composite, InFORMS® ESM02, which is specifically designed to produce consistent bondline thickness for

Indium Corporation will feature its indium and gallium metals and compounds, and their related reclaim services, at SVC TechCon 2019, April 27-May 2 in Long Beach, California, USA. Indium

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the EPP InnovationsForum Germany conference on March

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach