Communiqués de presse

CLINTON, NY – Indium Corporation employees throughout the Mohawk Valley joined their counterparts around the world in celebration today, marking the company’s 85thanniversary.

CLINTON, NY – Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary. Indium Corporation was founded in 1934 in

Indium Corporation is participating in Productronica China’s newest live program on the show floor, which offers attendees a combined independent exhibition booth and product line

Indium Corporation will feature its new Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at Productronica China, March 20-22, in Shanghai,

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China.  The Indium8.9HF series is an air

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg,

Indium Corporation will feature its new reinforced matrixed solder composite, InFORMS® ESM02, which is specifically designed to produce consistent bondline thickness for

Indium Corporation will feature its indium and gallium metals and compounds, and their related reclaim services, at SVC TechCon 2019, April 27-May 2 in Long Beach, California, USA. Indium

Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the EPP InnovationsForum Germany conference on March

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy. 

Indium Corporation has released a new halogen-free, no-clean ROL0 flux specifically developed for PCB assembly hand soldering and rework applications.  TACFlux® 020B-RC passes SIR

Indium Corporation expert Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the Automotive Meets Electronics conference from March 12-13 in

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials,will present at the Semi-Therm 35thAnnual Symposium & Exhibit, March 18-22, in San Jose, Calif.,

Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA. Saumswill

Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM™ — during the Semi-Therm 35thAnnual Symposium & Exhibit, March

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring®and HSMF-OS, at TestConX on March 3-6 in Mesa,

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide

Indium Corporation is proud to announce the promotion of three employees to high-level positions in their respective departments.  Scott Pringle has been promoted to Business Unit Vice

Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company's proven products live on the show floor, as well as an

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award. Indium Corporation’s Silver Quill Award program recognizes individuals who have authored