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Indium Corporation Celebrates 85 Years in the Mohawk Valley
CLINTON, NY – Indium Corporation employees throughout the Mohawk Valley joined their counterparts around the world in celebration today, marking the company’s 85thanniversary.
Indium Corporation Celebrates 85 Years of Technology Innovation and Growth
CLINTON, NY – Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary. Indium Corporation was founded in 1934 in
Indium Corporation Products Featured in Smart Factory Innovation Concept Area at Productronica China 2019
Indium Corporation is participating in Productronica China’s newest live program on the show floor, which offers attendees a combined independent exhibition booth and product line
Indium Corporation Features New WS-446HF Flip-Chip and WS-823 Ball-Attach Fluxes at Productronica China
Indium Corporation will feature its new Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at Productronica China, March 20-22, in Shanghai,
Indium Corporation to Feature Indium8.9HF Solder Paste at Productronica China
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China. The Indium8.9HF series is an air
Indium Corporation Features Indium8.9HF Solder Paste Series at SMTconnect 2019
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg,
Indium Corporation Features New InFORMS ESM02 at APEC 2019
Indium Corporation will feature its new reinforced matrixed solder composite, InFORMS® ESM02, which is specifically designed to produce consistent bondline thickness for
Indium Corporation Features Indium and Gallium at SVC TechCon 2019
Indium Corporation will feature its indium and gallium metals and compounds, and their related reclaim services, at SVC TechCon 2019, April 27-May 2 in Long Beach, California, USA. Indium
Indium Corporation Expert to Present at EPP InnovationsForum Germany 2019
Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the EPP InnovationsForum Germany conference on March
Indium Corporation Launches InFORMS ESM02 for Die-Level Bonding
Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach
Indium Corporation Expert to Present at World Congress of Smart Materials 2019
Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, will present at BIT's 5thAnnual World Congress of Smart Materials, March 6-8 in Rome, Italy.
Indium Corporation Launches New No-Clean Flux for Reflow, Hand Soldering
Indium Corporation has released a new halogen-free, no-clean ROL0 flux specifically developed for PCB assembly hand soldering and rework applications. TACFlux® 020B-RC passes SIR
Indium Corporation Expert to Present at Automotive Meets Electronics 2019
Indium Corporation expert Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the Automotive Meets Electronics conference from March 12-13 in
Indium Corporation Expert to Present at Semi-Therm 2019
Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials,will present at the Semi-Therm 35thAnnual Symposium & Exhibit, March 18-22, in San Jose, Calif.,
Indium Corporation Advisor to Present at TestConX 2019
Indium Corporation advisor and founder/principal of DS&A LLC, David Saums, will present at TestConX 2019 from March 3-6, in Mesa, Arizona, USA. Saumswill
Indium Corporation Features Unique Metal Thermal Interface Materials at Semi-Therm 2019
Indium Corporation will feature its unique solid/liquid hybrid metal thermal interface materials — m2TIM™ — during the Semi-Therm 35thAnnual Symposium & Exhibit, March
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring®and HSMF-OS, at TestConX on March 3-6 in Mesa,
Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide
Indium Corporation Announces Senior Level Promotions
Indium Corporation is proud to announce the promotion of three employees to high-level positions in their respective departments. Scott Pringle has been promoted to Business Unit Vice
Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor
Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company's proven products live on the show floor, as well as an
Indium Corporation Names Silver Quill Award Winners
Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award. Indium Corporation’s Silver Quill Award program recognizes individuals who have authored
