Communiqués de presse

Indium Corporation’s Kim Flanagan, Technical Support Engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland. Bottom termination component (BTC)

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at NEPCON South China, August 28-30, in Shenzhen, China. Indium8.9HF Solder Paste is an air reflow, no-clean

Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India.

Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will deliver two presentations and lead a course at the 38th International Electronics Manufacturing

Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China. Liang’s presentation,

Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Shanghai Seminar on July 19 in Shanghai, China. Pony’s

Indium Corporation will feature Indium8.9HF and Indium10.1 Solder Pastes at SMTA Queretaro Expo & Tech Forum on July 12 in Juriquilla, QR, Mexico. These exceptional materials help increase

Indium Corporation, Utica’s Technology Company®, welcomes Carolyn Cardone as Assistant Plant Manager at the company’s Business Park Drive (BPD) facility.  Cardone works closely

Indium Corporation, Utica’s Technology Company®, is proud to announce that twenty-two employees have successfully completed Dale Carnegie® professional training and leadership

Indium Corporation, Utica’s Technology Company®, announces 10 new students who comprise the company’s 2018 college Internship Program. The goal of Indium Corporation’s

Indium Corporation is proud to announce that three company engineers have earned their designation as Lean Six Sigma Green Belt-certified. With their recent designation, Daniel Siedsma, Chemical

Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate two expert panels at International Conference for Electronics Enabling

Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany. Vijay will

Two Indium Corporation experts will present at SMT Hybrid Packaging on Tuesday, June 5, in Nuremberg, Germany. Karthik Vijay, Technical Manager, Europe, Africa, and the Middle

Indium Corporation has launched a mobile-friendly version of its website specifically designed for the Chinese market. This new Chinese language site, www.indiumchina.cn, includes content that

Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Institute of Electrical and Electronics Engineers (IEEE) 68th Electronic Components and

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe, June 5-7, in Nuremberg, Germany. Indium Corporation is redefining solder with

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at SMT Hybrid Packaging, June 5-7, in Nuremberg, Germany. Indium8.9HF Solder Paste is an air reflow, no-clean

Indium Corporation is proud to announce that two company technologists have earned their designation as SMTA-Certified Process Engineers. Joining a host of certified Indium Corporation engineers

Indium Corporation’s Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at SEMICON South East Asia’s Advanced Packaging Forum on

Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22,