Pressemitteilungen

Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation

Indium Corporation experts will share their knowledge and insights at two separate Electronic Industries Association of India (ELCINA) events at Productronica India from Sept. 26-28 in

Indium Corporation experts will share their industry knowledge and skill at SMTA International from Oct. 14-18 in Rosemont, Ill. The following technical papers from Indium Corporation

Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will host a one-hour Thermal Live™ webinar at 10 a.m. EST on Oct. 23 regarding Innovation Metal Thermal

Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif. The following technical presentations from Indium Corporation

Indium Corporation will feature Indium11.8HF-SPR Solder Paste a new no-clean, Pb-free solder paste designed to meet the current and future fine feature printing requirements of mobile

Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void® at SMTA International from Oct. 14-18 in Rosemont,

Indium Corporation’s Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on Sept. 6 in Taipei, Taiwan.

Indium Corporation’s Graham Wilson, Applications Engineer, will give a poster presentation at TEC Lund on Sept. 27 in Lund, Sweden. Wilson will present High-Power Device

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif. Indium Corporation is redefining solder with its

Die Indium Corporation wird auf der SEMICON Taiwan 2018 vom 5. bis 7. September in Taipeh ihr Flip-Chip-Flussmittel WS-446HF und ihr Ball-Attach-Flussmittel WS-823 vorstellen,

Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, shared his extensive industry knowledge during a workshop at EPCON Asia 2018 from Aug. 8-9 in Kuala Lumpur,

Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan. Indium Corporation’s Indium3.2HF is a

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology

Indium Corporation’s Geoff Wang, Area Technical Manager for SMT, will share his technical expertise at the 2018 IPC Electronics Assembly High Reliability Technology Conference on Aug. 23 in

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, shared his expertise during two professional development courses at the 19th International Conference on

Indium Corporation’s Kim Flanagan, Technical Support Engineer, will present at SMTA Capital’s Expo & Tech Forum on August 23 in Laurel, Maryland. Bottom termination component (BTC)

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste at NEPCON South China, August 28-30, in Shenzhen, China. Indium8.9HF Solder Paste is an air reflow, no-clean

Indium Corporation and MEL Systems and Services Ltd. (MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India.

Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will deliver two presentations and lead a course at the 38th International Electronics Manufacturing

Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China. Liang’s presentation,