Communiqués de presse

Indium Corporation announces that Sean DeZalia has joined Indium Corporation as a chemical engineer. DeZalia will focus on performing and documenting laboratory experiments. His responsibilities

Indium Corporation’s Liyakathali Koorithodi, Senior Technical Support Engineer, will present at IPC APEX India Wednesday, August 28 in Bangalore,

Indium Corporation’s Greg Evans, President and CEO, was presented with the Alumni of Merit Award by Mohawk Valley Community College. Evans earned his associate degree in engineering science

Indium Corporation’s Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association’s Ohio Valley Expo and Tech Forum, July 11 in Independence,

Indium Corporation's new SACm™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at

Indium Corporation’s Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting

Indium Corporations Tim Jensen, Product Manager PCB Assembly Materials, will present a two-part webtorial, titled Top Pb-Free PCB Assembly Defects: Cause and Cure, as part of a webtorial series

Indium Corporation’s Ed Briggs, Technical Support Engineer, Southeast USA and Eastern Canada, will participate in the Solder Joint Failure Analysis session at the Surface Mount Technology

Indium Corporations Dr. Ning-Cheng Lee, Vice President of Technology, will present at IPCs Innovations in Electronics Manufacturing for Medical Devices conference Wednesday, June 12 in Minneapolis,

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give several presentations at the 63rd Electronic Components and Technology Conference (ECTC) May 28-31 in Las Vegas,

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced

Indium Corporations Brook Sandy-Smith, Product Specialist PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev. Sandy-Smith will

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Conference on Soldering and Reliability on Friday, May 17 in

Indium Corporation will feature Heat-Spring® thermal interface materials at PCIM Europe, May 14-16, in Nuremberg, Germany. Heat-Spring®, a compressible thermal interface material (TIM), is a

Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however,

Several Indium Corporation technology experts will present their technical findings at the International Microelectronics and Packaging Society (IMAPS) New England Chapter Symposium May 7 in

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at PCIM Europe 2013 at 10 a.m., Thursday, May 16 in Nuremberg,

Indium Corporation’s Andy C. Mackie, PhD, MSc, will share his expertise at the IMAPS Advanced Technology Workshop on Packaging the Next Generation of Nano Devices April 30-May 1 in Albany, N.Y.

Indium Corporation will feature its new SACm™ solder alloy at the inaugural ESTC exhibition May 21-22 in Las Vegas, Nev. SACm™ is a high-reliability, low-cost solder alloy that offers

Indium Corporation will feature NanoFoil® at the Society of Vacuum Coaters (SVC) Technical Conference April 23-24 in Providence, R.I. NanoFoil® is an engineered material that enables room

Indium Corporation’s Tim Jensen, Product Manager – PCB assembly materials; Dr. Yan Liu, Research Chemist; and Sehar Samiappan, Area Technical Manager for North Malaysia, the Philippines,