プレスリリース

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Conference on Soldering and Reliability on Friday, May 17 in

Indium Corporation will feature Heat-Spring® thermal interface materials at PCIM Europe, May 14-16, in Nuremberg, Germany. Heat-Spring®, a compressible thermal interface material (TIM), is a

Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however,

Several Indium Corporation technology experts will present their technical findings at the International Microelectronics and Packaging Society (IMAPS) New England Chapter Symposium May 7 in

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at PCIM Europe 2013 at 10 a.m., Thursday, May 16 in Nuremberg,

Indium Corporation’s Andy C. Mackie, PhD, MSc, will share his expertise at the IMAPS Advanced Technology Workshop on Packaging the Next Generation of Nano Devices April 30-May 1 in Albany, N.Y.

Indium Corporation will feature its new SACm™ solder alloy at the inaugural ESTC exhibition May 21-22 in Las Vegas, Nev. SACm™ is a high-reliability, low-cost solder alloy that offers

Indium Corporation will feature NanoFoil® at the Society of Vacuum Coaters (SVC) Technical Conference April 23-24 in Providence, R.I. NanoFoil® is an engineered material that enables room

Indium Corporation’s Tim Jensen, Product Manager – PCB assembly materials; Dr. Yan Liu, Research Chemist; and Sehar Samiappan, Area Technical Manager for North Malaysia, the Philippines,

Indium Corporation’s Jacques Matteau, Global Sales Manager – NanoBond® and NanoFoil®, and Jim Hisert, PV Applications Engineer, will present at the Society of Vacuum Coaters (SVC)

Indium Corporation’s Joe Bahou, Technical Sales Support Engineer – West Coast, will present at the SMTA’s Silicon Valley chapter meeting on April 11. Bahou’s presentation,

Indium Corporation announces the creation of a Nanotechnology Team to support Indium Corporations continued expansion into novel nanotechnology materials and markets. Nanotechnology is a term that

Indium Corporation announces the appointment of Derrick Herron to Technical Support Engineer for the Northeastern United States. In this role, Herron will provide comprehensive technical advice in

Indium Corporation’s Ning-Cheng Lee, Vice President of Technology; Karthik Vijay, Technical Manager – Europe, Africa, and the Middle East; and Wolfgang Bloching, Regional Sales Manager

Indium9.91 is a no-clean solder paste designed for use in package-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and package retention. Indium9.91: Eliminates

Indium Corporation will feature its Indium8.9HFA Solder Paste and Solder Fortification® preforms at SMT Nuremberg April 16-18 in Nuremberg, Germany. Indium8.9HFA delivers unsurpassed print

Indium Corporation’s Jordan Ross, Senior Product Manager – Engineered Solders and Thermal Materials, and Dr. Weiping Liu, Research Metallurgist, will present a workshop on Composite

Indium Corporation will feature metal thermal interface materials (TIMs) at Semiconductor Thermal Management and Measurement Symposium (Semi-Therm), on March 17-21 in San Jose, CA. Indium Corporation

Indium Corporation’s Maria Durham, Product Specialist – Semiconductor and Advanced Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS)

Indium Corporation’s Tim Jensen, Product Manager – PCB assembly materials, will present his technical findings at two regional SMTA shows in Texas; Dallas on March 12 and Houston on March

Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Minerals, Metals, and Materials Society (TMS) on March 7, 2013 in San Antonio, Texas. Dr. Zhang’s