LoW-Temperature Solder Pastes
Bi+ Solder Alloy
The patented Bi+ alloy, also known as Indalloy®303, is an innovative low-temperature solder developed by Indium Corporation to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. With enhanced thermal cycling capabilities and compatibility with Indium Corporation’s low-temperature flux technologies, Bi+ sets a new standard in the soldering industry.
Powered by Indium Corporation
- Temperature-Sensitive Components
- Enhanced Thermal Cycling Reliability
- Lower Cost of Ownership
Product Overview
Reduced Thermal Warpage
Minimizes warpage in multilayer boards and miniaturized components, reducing defect rates during assembly.
Reduced Cost
Offers customers an affordable material and opportunity to reduce energy bills and oven maintenance investments.
Enhanced Thermal Cycling Reliability
Provides superior performance in thermal cycling, ensuring longevity and reliability of solder joints.
Enables Step Soldering
Allows for step soldering and other complex designs that require a solder alloy with lower reflow temperature.
Quick Facts
Related Applications
The Bi+ alloy is suitable for a number of applications. Contact Indium Corporation Technical Support for more information.
Low-Temperature Soldering
Transform your operations with our low-temp soldering
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Related Markets
Bi+ delivers excellent low-temperature performance compared to traditional Bismuth containing alloys and can be used in various markets.
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Indalloy®301LT
Indalloy® 301LT offers versatile solder forms & enhances reliability with lower processing temperatures using InFORMS®
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