Products Solder Pastes Bi+

LoW-Temperature Solder Pastes

Bi+ Solder Alloy

The patented Bi+ alloy, also known as Indalloy®303, is an innovative low-temperature solder developed by Indium Corporation to meet the challenges of modern electronics manufacturing. Featuring a unique doped bismuth composition, Bi+ delivers outstanding reliability and performance for sensitive components that demand precise thermal management. With enhanced thermal cycling capabilities and compatibility with Indium Corporation’s low-temperature flux technologies, Bi+ sets a new standard in the soldering industry.

Powered by Indium Corporation

  • Temperature-Sensitive Components
  • Enhanced Thermal Cycling Reliability
  • 更低的擁有成本
藍色漸層標誌，顯示「Bi」字樣，後跟一個加號。

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Reduced Thermal Warpage

Minimizes warpage in multilayer boards and miniaturized components, reducing defect rates during assembly.

Reduced Cost

Offers customers an affordable material and opportunity to reduce energy bills and oven maintenance investments.

Enhanced Thermal Cycling Reliability

Provides superior performance in thermal cycling, ensuring longevity and reliability of solder joints.

啟用步驟焊接

Allows for step soldering and other complex designs that require a solder alloy with lower reflow temperature.

速覽

–40 to +85°C

Thermal Cycling Range

Bi+ provides excellent thermal cycling performance for low-temperature applications

170°C

Peak Temperature

Bi+ is a specially formulated near eutectic alloy that allows for reflow soldering at a peak temperature of approximately 170°C.

相關應用程式

The Bi+ alloy is suitable for a number of applications. Contact Indium Corporation Technical Support for more information.

低溫焊接

低溫焊接

Transform your operations with our low-temp soldering…

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印刷電路板上的微晶片

PCB 組裝

Proven and cutting-edge materials for PCB assembly…

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相關市場

Bi+ delivers excellent low-temperature performance compared to traditional Bismuth containing alloys and can be used in various markets.

相關產品

兩個由 Indium Corporation 製造的 Durafuse LT 綠色容器，包括先進的 Durafuse 110，背景為素色。

低溫焊膏

Extensive range of low-temperature solder pastes.

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各種焊料合金

焊料合金

Wide range of solder alloys with melting…

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電子元件的剖視圖，包括以線性順序排列、帶有銅接頭的黑色矩形模組。

Indalloy®301LT

Indalloy® 301LT offers versatile solder forms &…

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白皮書

使用免工具焊料預成型技術降低功率模組組裝的製造設計複雜性 TPT 100165 R0.pdf

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Indium5.7LT-1 與Indalloy®303(Bi+) 增強型低溫焊膏 PDS 99862 R1.pdf

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互連可靠性：從晶片到系統

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最小化篩選

各位，這篇文章是摘錄自 Indium Corporation 的《印刷電路組裝人員焊錫缺陷指南》(The Printed Circuits Assemblers Guide to Solder Defects)中關於繪圖的內容。引言 個人電子設備的成長持續

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Lately I have been researching a bunch of things, one of my favorite topics being soldering alloys. For a long time most solder (nearly all) was comprised of tin-lead eutectic

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